5-o-Tolyloxy-bicyclo[2.2.1]hept-2-ene | 18953-70-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 5-o-Tolyloxy-bicyclo[2.2.1]hept-2-ene
• 英文别名: 5-(2-Methylphenoxy)bicyclo[2.2.1]hept-2-ene
• CAS: 18953-70-3
• 化学式: C₁₄H₁₆O
• 分子量: 200.28
• InChiKey: IILGONGLRASCAC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  15
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT
  申请人：Mitsui Chemicals, Inc.

  公开号：EP3693793A1

  公开（公告）日：2020-08-12

  Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G') curve and a loss modulus (G") curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30°C to 300°C, a heating rate of 3°C/min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40°C and lower than or equal to 200°.

  本发明提供了一种用于形成底层膜的树脂材料，该底层膜可用于形成多层光刻胶工艺中使用的光刻胶底层膜，该树脂材料包括环烯烃聚合物 (I)、其中，用于形成底层膜的树脂材料的固体粘弹性中的存储模量（G'）曲线和损失模量（G"）曲线的交点温度高于或等于 40°C，且低于或等于 200°C；该固体粘弹性是在测量温度范围为 30°C 至 300°C、加热速率为 3°C/min 和频率为 1 Hz 的条件下，在氮气环境中使用流变仪以剪切模式测得的。
• RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
  申请人：MITSUI CHEMICALS, INC.

  公开号：US20200241419A1

  公开（公告）日：2020-07-30

  Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.
• MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
  申请人：MITSUI CHEMICALS, INC.

  公开号：US20200264511A1

  公开（公告）日：2020-08-20

  A material for forming an underlayer film according to the present invention is a material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the material including a cyclic olefin polymer which has a repeating structural unit [A] represented by Formula (1) and a repeating structural unit [B] represented by Formula (2), in which a molar ratio [A]/[B] of the structural unit [A] to the structural unit [B] in the cyclic olefin polymer is greater than or equal to 5/95 and less than or equal to 95/5.