4-(4-aminophenoxy) benzoic acid | 28999-69-1

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-(4-aminophenoxy) benzoic acid
• 英文别名: 4-(4-amino-phenoxy)-benzoic acid；4'-Amino-diphenylaether-carbonsaeure-(4)；4-(4-Amino-phenoxy)-benzoesaeure；p-(p'-Aminophenoxy)-benzoesaeure；4-(p-Aminophenoxy)-benzoesaeure；4-(4-Aminophenoxy)benzoesaeure；4-(4-Aminophenoxy)benzoic acid
• CAS: 28999-69-1
• 化学式: C₁₃H₁₁NO₃
• mdl: MFCD00446982
• 分子量: 229.235
• InChiKey: DVFCGSZRLJQHJA-UHFFFAOYSA-N

物化性质

• 沸点：
  432.3±30.0 °C(Predicted)
• 密度：
  1.311±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  72.6
• 氢给体数：
  2
• 氢受体数：
  4

安全信息

• 海关编码：
  2922509090

反应信息

• 作为反应物：
  描述：

  4-(4-aminophenoxy) benzoic acid 在 4-二甲氨基吡啶 、 盐酸-N-乙基-Nˊ-(3-二甲氨基丙基)碳二亚胺 、 三乙胺 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 1.0h， 生成 N-(3-azidopropyl)-4-(4-(3-methoxy-5-oxocyclohex-3-enecarboxamido)phenoxy)benzamide
  参考文献：
  名称：

  Redox-Based Probes for Protein Tyrosine Phosphatases

  摘要：

  DOI：

  10.1002/anie.201007871
• 作为产物：
  描述：

  4-(4-硝基苯氧基)苯甲酸 在 盐酸 、 tin 作用下， 生成 4-(4-aminophenoxy) benzoic acid
  参考文献：
  名称：

  Haeussermann; Bauer, Chemische Berichte, 1896, vol. 29, p. 2084

  摘要：

  DOI：

文献信息

• [EN] SORAFENIB ANALOGS AND USES THEREOF<br/>[FR] ANALOGUES DE SORAFENIB ET LEURS UTILISATIONS
  申请人：UNIV COLUMBIA

  公开号：WO2015051149A1

  公开（公告）日：2015-04-09

  The present invention provides, inter alia, compounds according to formula I. Also provided are pharmaceutical compositions and kits containing such compounds. Methods for using such compounds, compositions, and kits for treating a subject having system xc-, dysregulation for activating ferroptosis, for inhibiting system xc- in a cell, and for monitoring treatment of a subject having system xc- dysregulation are provided as well.

  本发明提供了根据式I的化合物，还提供了含有这种化合物的药物组合物和试剂盒。还提供了使用这种化合物、组合物和试剂盒治疗具有系统xc-失调以激活铁死亡、在细胞中抑制系统xc-以及监测具有系统xc-失调的受试者治疗的方法。
• SOLUBLE EPOXIDE HYDROLASE INHIBITORS
  申请人：Gless, JR. Richard D.

  公开号：US20090023731A1

  公开（公告）日：2009-01-22

  Disclosed are urea and thiourea compounds and compositions that inhibit soluble epoxide hydrolase (sEH), methods for preparing the compounds and compositions, and methods for treating patients with such compounds and compositions. The compounds, compositions, and methods are useful for treating a variety of sEH mediated diseases, including hypertensive, cardiovascular, inflammatory, and diabetic-related diseases.

  本发明涉及一种抑制可溶性环氧水解酶（sEH）的尿素和硫脲化合物及其组合物和组合物的制备方法，以及使用这些化合物和组合物治疗患者的方法。这些化合物、组合物和方法对于治疗各种sEH介导的疾病，包括高血压、心血管、炎症和糖尿病相关疾病非常有用。
• HYBRID EPOXY RESINS
  申请人：DOW GLOBAL TECHNOLOGIES LLC

  公开号：US20140114047A1

  公开（公告）日：2014-04-24

  A hybrid polyfunctional aliphatic and/or cycloaliphatic epoxy (H-PACE) resin composition comprising, consisting of or consisting essentially of: (a) a moiety selected from the group consisting of an aliphatic moiety, a cycloaliphatic moiety, and combinations thereof provided by the polyfunctional aliphatic and/or cycloaliphatic epoxy (PACE) resin; and (b) a moiety selected from the group consisting of an aliphatic moiety, a cycloaliphatic moiety, and combinations thereof, wherein said moiety is not provided by the PACE resin, is disclosed. Processes for making and using such resin composition are also disclosed.

  本发明涉及一种混合多功能脂肪族和/或环脂族环氧（H-PACE）树脂组合物，包括、由以下成分组成或实质上由以下成分组成：（a）由多功能脂肪族和/或环脂族环氧（PACE）树脂提供的脂肪族、环脂族或两者的一部分；以及（b）由不由PACE树脂提供的脂肪族、环脂族或两者的一部分。本发明还公开了制备和使用这种树脂组合物的方法。
• Improved process for forming thermally stable thermotropic liquid crystalline polyesters of predetermined chain length
  申请人：CELANESE CORPORATION

  公开号：EP0133024A2

  公开（公告）日：1985-02-13

  An improved polymerisation process is provided for the formation of a polyester which is capable of forming an anisotropic melt phase and which optionally may include amide linkages. An approximately 0.4 to 3 percent molar excess of aromatic dicarboxylic acid monomer (e.g. terephthalic acid) and/or an esterified derivative thereof is provided in the polymerisation zone during the polymerisation reaction. Such monomer imparts dicarboxyaryl units to the interior of the resulting polymer chains and causes the polymer chains to terminate in carboxylic acid end groups and/or an esterified derivative thereof wherein the polymer chains achieve a predetermined average chain lengththrough the depletion of other monomers present in the polymerisation zone. The resulting polyester unlike the usual product of the prior art is substantially incapable of additional chain growth upon subsequent heating and accordingly may be relied upon to maintain a substantially constant viscosity during melt processing regardless of the duration of heating.

  本发明提供了一种改进的聚合工艺，用于形成一种可形成各向异性熔体相的聚酯，该聚酯可选择性地包括酰胺连接。在聚合反应过程中，在聚合区中加入约 0.4%至 3%摩尔过量的芳香族二羧酸单体（如对苯二甲酸）和/或其酯化衍生物。这种单体将二羧基芳基单元赋予所产生的聚合物链的内部，并使聚合物链以羧酸末端基团和/或其酯化衍生物终止，其中聚合物链通过耗尽聚合区中存在的其他单体而达到预定的平均链长。由此产生的聚酯与现有技术中的普通产品不同，在后续加热过程中基本上不会产生额外的链增长，因此在熔融加工过程中，无论加热时间长短，都能保持基本恒定的粘度。
• Moulding compositions for the encapsulation of electronic components
  申请人：CELANESE CORPORATION

  公开号：EP0135310A2

  公开（公告）日：1985-03-27

  (D An improved thermoplastic moulding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mould cavity prior to the introduction of the moulding composition via injection moulding. The moulding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves advantageously to decrease its volumetric coefficient of thermal expansion and advantageously to increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such as a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly non-burning and relatively inexpensive package is provided.

  (D) 提供了一种改进的热塑性模塑组合物，该组合物特别适用于在相对较快的基础 上对电子元件进行不透水无空隙封装，其中在通过注塑成型引入模塑组合物之 前，将预制电子元件置于模腔中。模塑组合物包括一种可熔融加工的热致性液晶聚合物，其平均分子量相对较低，约为 4,000 至 25,000 （例如约为 4,000 至 10,000），并且在加热时基本上不能再发生链增长。均匀地分散在液晶聚合物中的颗粒状无机材料（最好是二氧化硅）的重量百分比约为 40%至 80%（例如约为 50%至 75%），可降低其体积热膨胀系数并提高其热导率。在一个优选的实施方案中，被封装的电子元件是一个半导体器件，如一个相对精致的四线或双线集成电路器件，它被装配在一个扁平的预冲压引线框架或其他导电装置上，该导电装置有多条引线，这些引线延伸到被封装区域之外。尽管液晶聚合物的分子量相对较低，但封装后的电子元件仍受到很好的保护，即使遇到不利的环境条件，也能在较长的时间内提供令人满意的服务。这种封装坚固耐用，通常不会燃烧，而且成本相对较低。