Described herein is a composite structure comprising (a) a solid dielectric support surface; (b) a layer or pathway comprising a thermoset resin and containing sufficient electrically conductive metal particles, in the configuration of at least an electric circuit element, to provide desired properties and preferably to satisfy the Soldering Standard Test (hereinafter defined) and preferably to provide an electric circuit element having a low surface resistivity of 0.1 ohm per square or less. Also described are inks for printed circuit devices, circuit transfer means, and methods for making the same.
本文描述的是一种复合结构,包括(a)固体电介质支撑表面;(b)由热固性
树脂组成的层或通路,其中含有足够的导电
金属颗粒,至少具有电路元件的结构,以提供所需的性能,最好能满足焊接标准测试(以下定义),最好能提供具有每平方 0.1 欧姆或更小的低表面电阻率的电路元件。此外,还介绍了用于印刷电路装置的油墨、电路传输装置以及制造方法。