Bulky triarylarsines are effective ligands for palladium catalysed Heck olefination
作者:R. Angharad Baber、Simon Collard、Mark Hooper、A. Guy Orpen、Paul G. Pringle、Matthew J. Wilkinson、Richard L. Wingad
DOI:10.1039/b417910b
日期:——
square-planar and octahedral complexes. The variable-temperature NMR behaviour of the complexes shows that they are fluxional due to restricted As–C bond rotation. The rate of the fluxionality is more rapid than in the analogous phosphine complexes and this is associated with longer As–C and As–M bonds allowing more free movement. The catalytic activity of the palladium complexes of the arsines and their phosphine
四个 rs,As C 6 H 3(o -CH 3)(p -Z)} 3 Z = H(2a)或OMe(2b)}和As C 6 H 3(o -CHMe 2)(p -Z )} 3 Z = H(2c)或OMe(2d)}与[PdCl 2(NCPh)2 ]或[PtCl 2(NCBu t)2 ]反应,得到反式-[MCl 2 L 2 ]或反式-[中号2 Cl 2(μ-Cl) 2 L 2 ]。反式-[PdCl 2( 2a) 2 ]和[PtCl 2( 2d) 2 ]的晶体结构已经确定,后者为二氯甲烷溶剂化。结构表明,在这些复合物中,配体采用正方形构型和八面体络合物中所有类似的三邻甲苯基和三邻异丙基苯基膦一样的类型构型。这变温核磁共振配合物的行为表明,由于As-C键旋转受限制,它们是通量的。通量的速率比类似的更快膦复合物,这与更长的As–C和As–M键相关,从而允许更多的自由移动。钯钯配合物的催化活性。rs
Special effects of ortho-isopropylphenyl groups. Diastereoisomerism in platinum(ii) and palladium(ii) complexes of helically chiral PAr3 ligands
作者:R. Angharad Baber、A. Guy Orpen、Paul G. Pringle、Matthew J. Wilkinson、Richard L. Wingad
DOI:10.1039/b416525j
日期:——
PC6H3(o-CHMe2)(p-Z)}3 Z = H (1c) or OMe (1d) with platinum(II) and palladium(II) is reported. Mononuclear complexes trans-[PdCl2L2](L = 1a,b) and trans-[PtCl2L2](L = 1a-c) have been prepared and the crystal structures of trans-[PdCl2(1b)2] and trans-[PtCl2(1c)2] as their dichloromethane solvates have been determined. The structures show that in these complexes, the ligands adopt g+ g+ a conformations. Examination of
四种膦的配位化学,P C6H3(o-CH3)(pZ)} 3其中Z = H(1a)或OMe(1b)和P C6H3(o-CHMe2)(pZ)} 3 Z = H (1c)或OMe(1d)中含有铂(II)和钯(II)。制备了单核复合物反式[PdCl2L2](L = 1a,b)和反式[PtCl2L2](L = 1a-c),反式[PdCl2(1b)2]和反式[PtCl2( 1c)2],因为它们的二氯甲烷溶剂化物已经确定。结构表明,在这些络合物中,配体采用g + g + a构象。剑桥结构数据库的检查确认这是三邻甲苯基膦所采用的仅有的两种构象异构体之一,并且是4和6配合物中唯一可行的构象异构体。即使过量的大体积1c,也会形成双核复合物反式-[Pd2Cl4L2](L = 1c,d),d用于合成中,并报道了反式-[Pd2Cl4(1c)2]的氯仿溶剂化物的晶体结构。[PtCl2(NCBu(t))2]与1b-
[EN] PROCESS FOR THE PREPARATION OF 3-METHYLENE-?-BUTYROLACTONE<br/>[FR] PROCÉDÉ POUR LA PRÉPARATION DE 3-MÉTHYLÈNE-G-BUTYROLACTONE
申请人:DSM IP ASSETS BV
公开号:WO2012116977A1
公开(公告)日:2012-09-07
The invention relates to a process for the preparation of 3-methylene-γ-butyrolactone (Z), the process comprising a hydroformylation step wherein 1,4-butene-diol (X) or its ester derivative cis-1,4-diacetoxy butene (Y) is subjected to H2 gas and CO gas in the presence of a hydroformylation catalyst, thereby forming an intermediate product comprising a mixture of compounds containing an aldehyde group or a hemiacetal, and an oxidation step wherein the intermediate product or hydrolyzed derivative thereof is oxidized by an oxidation agent thereby forming Z.
Verfahren zur Herstellung von Alpha-Methylen-Beta-Methyl-Gamma-Butyrolacton und als Zwischenprodukt wertvolle 4-Hydroxy-Butyraldehyde sowie 2-Hydroxy-3-Methylen-4-Methyltetrahydrofuran
申请人:Degussa Aktiengesellschaft
公开号:EP0841332A1
公开(公告)日:1998-05-13
Eine von Isobuten ausgehende Pd-katalysierte Acetoxylierung mit anschließender Hydroformylierung liefert Aldehyde, welche in α-Stellung mittels Mannich-Reaktion zu den entsprechenden α-Methylen-substituierten Aldehyden umgesetzt werden können.
Für die Verbindungen (VII/II/III) wird Substanzschutz beantragt, da sie wertvolle Intermediate zur Synthese von α-Methylen-β-methyl-γ-butyrolacton darstellen. (VII/II/III) können leicht durch Oxidation und Ringschluß, im Falle von (VII) durch Umsetzung, zu dem Zielprodukt umgewandelt werden.
Die bisher nicht in befriedigenden Ausbeuten oder nur mittels teurer Chemikalien oder schwierig im technischen Maßstab einzusetzender Apparaturen herstellbare Zielverbindung kann mit dem neuen Verfahren sehr vorteilhaft großtechnisch dargestellt werden.
Copolymer zur Herstellung wärmeformbeständiger Formmassen.
Epoxy resin molding material for sealing and electronic component device
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US10662315B2
公开(公告)日:2020-05-26
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.