The invention is directed to a radiation sensitive compound comprising a surface binding group proximate to one end of the compound for attachment to a substrate, and a metal binding group proximate to an opposite end of the compound. The metal binding group is not radiation sensitive. The radiation sensitive compound also includes a body portion disposed between the surface binding group and the metal binding group, and a radiation sensitive group positioned in the body portion or adjacent to the metal binding group. The surface binding group is capable of attaching to a substrate selected from a metal, a metal oxide, or a semiconductor material.
本发明涉及一种辐射敏感化合物,其包括一个表面结合基团,靠近化合物的一端用于附着于基质,并且一个
金属结合基团,靠近化合物的另一端。
金属结合基团不是辐射敏感的。辐射敏感化合物还包括一个位于表面结合基团和
金属结合基团之间的主体部分,以及位于主体部分或靠近
金属结合基团的辐射敏感基团。表面结合基团能够附着于
金属、金属氧化物或半导体材料等基质。