PHOTOPOLYMERISATION PROCESSES AND NOVEL COMPOUNDS THEREFOR
申请人:Lambson Limited
公开号:EP2877500B1
公开(公告)日:2016-10-19
US9303104B2
申请人:——
公开号:US9303104B2
公开(公告)日:2016-04-05
[EN] EPOXY DUAL CURE RESIN FOR THE PRODUCTION OF MOISTURE-RESISTANT ARTICLES BY ADDITIVE MANUFACTURING<br/>[FR] RÉSINE ÉPOXY À DOUBLE DURCISSEMENT POUR LA PRODUCTION D'ARTICLES RÉSISTANTS À L'HUMIDITÉ PAR FABRICATION ADDITIVE
申请人:[en]CARBON, INC.
公开号:WO2022066565A1
公开(公告)日:2022-03-31
A dual cure resin useful for the production of moisture-resistant objects by additive manufacturing is provided, said resin in some aspects comprising a mixture of: (a) a light-polymerizable component, said light polymerizable component comprising:(i)a light polymerizable monomer;(ii)a photoinitiator; and(iii)a dicyclopentadienyl (DCPD) (meth)acrylate reactive diluent; (b) a heat-polymerizable component, said heat-polymerizable component comprising:(i)an epoxy resin;(ii)a substituted or unsubstituted succinic anhydride or maleic anhydride curative;(iii)a core shell rubber toughener; and(iv)optionally, an epoxy-reactive toughening agent.