The present invention provides: a first sealing material for semiconductor device which sealing material is excellent in plasma resistance and inexpensive; and a second sealing material for semiconductor device and a method of manufacturing this sealing material wherein the sealing material has a good surface smoothness and a good dimensional precision. The first sealing material contains a fluororubber as a rubber component wherein the fluororubber inevitably contains a cured product of a fluorine-based elastic copolymer of a specific composition. The second sealing material is obtained by crosslinking, with ionizing radiation, a fluororubber preform containing a fluororubber component (a) (comprising a specific fluorine-based elastic copolymer) and a non-elastic fluororesin component (b) (comprising a vinylidene fluoride (co)polymer) in a specific ratio.
本发明提供了:一种用于半导体器件的第一密封材料,该密封材料具有优异的抗等离子体性能且价格低廉;以及一种用于半导体器件的第二密封材料和一种制造该密封材料的方法,其中该密封材料具有良好的表面光滑度和良好的尺寸精度。第一种密封材料含有
氟橡胶作为橡胶成分,其中
氟橡胶不可避免地含有特定成分的
氟基弹性共聚物的固化产物。第二种密封材料是通过电离辐射交联
氟橡胶预型件获得的,预型件中含有按特定比例配比的
氟橡胶成分(a)(包括特定的
氟基弹性共聚物)和非弹性
氟树脂成分(b)(包括
偏氟乙烯(共)聚合物)。