1-(4-{[4-(2,5-Dioxopyrrolidin-1-YL)phenyl]methyl}phenyl)pyrrolidine-2,5-dione | 17655-94-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 1-(4-{[4-(2,5-Dioxopyrrolidin-1-YL)phenyl]methyl}phenyl)pyrrolidine-2,5-dione
• 英文别名: 1-[4-[[4-(2,5-dioxopyrrolidin-1-yl)phenyl]methyl]phenyl]pyrrolidine-2,5-dione
• CAS: 17655-94-6
• 化学式: C₂₁H₁₈N₂O₄
• 分子量: 362.385
• InChiKey: FKPLSPSJTBPMIH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.24
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  1-(4-{[4-(2,5-Dioxopyrrolidin-1-YL)phenyl]methyl}phenyl)pyrrolidine-2,5-dione 、 2-苯基咪唑并[1,2-a]吡啶 在 五羰基溴化锰(I) 、 ammonium acetate 作用下， 以 四氢呋喃 为溶剂， 反应 18.0h， 以42%的产率得到1,1'-(methylenebis(4,1-phenylene))bis(3-(2-(imidazo[1,2-a]pyridin-2-yl)phenyl)pyrrolidine-2,5-dione)
  参考文献：
  名称：

  Solvent-Switched Manganese(I)-Catalyzed Regiodivergent Distal vs Proximal C–H Alkylation of Imidazopyridine with Maleimide

  摘要：

  DOI：

  10.1021/acs.orglett.1c02536
• 作为产物：
  描述：

  丁二酸酐 、 4,4'-二氨基二苯甲烷 反应 1.0h， 生成 1-(4-{[4-(2,5-Dioxopyrrolidin-1-YL)phenyl]methyl}phenyl)pyrrolidine-2,5-dione
  参考文献：
  名称：

  重新评估四氢邻苯二甲酸酐作为封端剂以提高加成聚酰亚胺的抗氧化性

  摘要：

  几个取代的1,2,3,6-四氢邻苯二甲酸酐端基，包括3-苯基，3-甲氧基，3-三甲基甲硅烷氧基和3,6-二苯基类似物，是通过相应丁二烯和丁二烯的Diels-Alder缩合合成的。马来酸酐。将这些酸酐以及可商购的3-氢和4-甲基类似物分别与亚甲基二苯胺以2：1的比例一起研磨，并逐渐从204加热到371°C，并进行热解和NMR。一般而言，在较低温度范围内观察到通过单酰亚胺到双酰亚胺的转变，然后是交联和芳构化之间的竞争。我们相信，这种竞争会产生很大比例的芳香产品，伴随着交联的相对量的降低，并且导致四氢邻苯二甲酸端基封端的聚酰亚胺的热氧化稳定性的提高以及它们的易碎性。在惰性气氛下四氢邻苯二甲酰亚胺的热解显着降低了芳构化的量。因此，芳香化的机制是一种氧化机制。

  DOI：

  10.1021/ma0353078

文献信息

• CHEMICAL COMPOUNDS HAVING ANTIVIRAL ACTIVITY AGAINST DENGUE VIRUS AND OTHER FLAVIVIRUSES
  申请人：Centro De Ingenieria Genetica Y Biotecnologia

  公开号：EP2258356B1

  公开（公告）日：2017-09-27
• Halogen-Free High-Tg Resin Composition And Prepreg And Laminate Fabricated By Using The Same
  申请人：Guangdong Shengyi Sci. Tech Co., Ltd.

  公开号：US20130273796A1

  公开（公告）日：2013-10-17

  The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board
• COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH
  申请人：Henkel IP & Holding GmbH

  公开号：US20170322600A1

  公开（公告）日：2017-11-09

  Provided herein are compositions made from a matrix and a hydrated salt of an acid and a Group I or II element of the Periodic Table, and electronic devices assembled therewith.
• LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS
  申请人：HENKEL IP & HOLDING GMBH

  公开号：US20210163674A1

  公开（公告）日：2021-06-03

  Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
• LIQUID COMPRESSION MOLDING ENCAPSULANTS
  申请人：Henkel IP & Holding GmbH

  公开号：US20210253844A1

  公开（公告）日：2021-08-19

  Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.