hexa-(4-(2-ethylhexyl))phenylbenzene | 850804-49-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: hexa-(4-(2-ethylhexyl))phenylbenzene
• 英文别名: 4,4''-Bis(2-ethylhexyl)-3',4',5',6'-tetrakis[4-(2-ethylhexyl)phenyl]-1,1':2',1''-terphenyl；1,2,3,4,5,6-hexakis[4-(2-ethylhexyl)phenyl]benzene
• CAS: 850804-49-8
• 化学式: C₉₀H₁₂₆
• 分子量: 1207.99
• InChiKey: JWDUFQTZQJAPJL-UHFFFAOYSA-N

物化性质

• 沸点：
  955.3±65.0 °C(Predicted)
• 密度：
  0.947±0.06 g/cm3(Predicted)
• 溶解度：
  可溶于DCM、己烯、甲苯

计算性质

• 辛醇/水分配系数(LogP)：
  34.2
• 重原子数：
  90
• 可旋转键数：
  42
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.53
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为反应物：
  描述：

  hexa-(4-(2-ethylhexyl))phenylbenzene 在 三氯化铁 作用下， 以 硝基甲烷 、 二氯甲烷 为溶剂， 反应 0.75h， 以94%的产率得到2,5,8,11,14,17-hexa(4-(2-ethylhexyl))hexa-peri-hexabenzocoronene
  参考文献：
  名称：

  Influence of Alkyl Substituents on the Solution- and Surface-Organization of Hexa-peri-hexabenzocoronenes

  摘要：

  Three hexa-peri-hexabenzocoronenes (HBCs) with branched, bulky alkyl substituents of different lengths in the periphery of the aromatic core have been synthesized to tune the self-association properties in solution. H-1 NMR and photophysical measurements were used to probe the solution organization in comparison to the known hexa-dodecyl-substituted HBC in different solvent systems. Thermodynamic parameters for the self-association in solution, obtained by curve fitting of the concentration- and temperature-dependent NMR data using van't Hoff analysis, indicated that the self-association is an enthalpically driven process that is entropically disfavored. Photoluminescence and NMR results were both employed to determine the critical concentration where no self-association for different compounds occurred. The interactions between the molecules could be controlled by varying the nonsolvent content in the solvent mixtures, supporting the model of solvophobic effects. The spatial demand of the solubilizing side chains modulated the self-association in solution. This behavior was translated into the solution casting process, where the kinetic in addition to the thermodynamic parameters played an essential role for structure formation. The study illuminates the relationship between the solution association of HBCs and the morphology, when processed on a surface. These results are essential for the application of these materials in devices.

  DOI：

  10.1021/ja0430696
• 作为产物：
  描述：

  4,4'-bis(2-ethylhexyl)diphenylacetylene 在 dicobalt octacarbonyl 作用下， 以 1,4-二氧六环 为溶剂， 反应 12.0h， 以75%的产率得到hexa-(4-(2-ethylhexyl))phenylbenzene
  参考文献：
  名称：

  Influence of Alkyl Substituents on the Solution- and Surface-Organization of Hexa-peri-hexabenzocoronenes

  摘要：

  Three hexa-peri-hexabenzocoronenes (HBCs) with branched, bulky alkyl substituents of different lengths in the periphery of the aromatic core have been synthesized to tune the self-association properties in solution. H-1 NMR and photophysical measurements were used to probe the solution organization in comparison to the known hexa-dodecyl-substituted HBC in different solvent systems. Thermodynamic parameters for the self-association in solution, obtained by curve fitting of the concentration- and temperature-dependent NMR data using van't Hoff analysis, indicated that the self-association is an enthalpically driven process that is entropically disfavored. Photoluminescence and NMR results were both employed to determine the critical concentration where no self-association for different compounds occurred. The interactions between the molecules could be controlled by varying the nonsolvent content in the solvent mixtures, supporting the model of solvophobic effects. The spatial demand of the solubilizing side chains modulated the self-association in solution. This behavior was translated into the solution casting process, where the kinetic in addition to the thermodynamic parameters played an essential role for structure formation. The study illuminates the relationship between the solution association of HBCs and the morphology, when processed on a surface. These results are essential for the application of these materials in devices.

  DOI：

  10.1021/ja0430696