Asymmetric Arylation of 2,2,2-Trifluoroacetophenones Catalyzed by Chiral Electrostatically-Enhanced Phosphoric Acids
作者:Jie Ma、Steven R. Kass
DOI:10.1021/acs.orglett.8b00900
日期:2018.5.4
A series of highly reactive metal-free chiralphosphoricacids possessing positively charged phosphonium ion substituents are reported and have been applied to Friedel–Crafts alkylations of indoles and 2,2,2-trifluoromethyl aryl ketones. These catalysts are orders-of-magnitude more active and have similar or better enantioselectivities than their noncharged analogues. High tolerance to a range of substrates
Complexes of long alkyl chain tertiary phosphines. Part I. The preparation and characterization of platinum metal complexes of long-chain tertiary phosphine ligands
作者:S. Franks、F.R. Hartley
DOI:10.1016/s0020-1693(00)89336-6
日期:1981.1
Abstract The long chain tertiary phosphine ligands (P(CnH2n+1)3 and P CmH2m·1)3 have been used to prepare the following series of platinum, palladium and rhodium complexes: cis-[PtL2Cl2], trans-[PdL2Cl2], trans-[PtL2HCl] (L = trialkylphosphine only), [PtL4] and trans-[RhL2Cl(CO)]. The complexes are very soluble in chlorinated solvents and both aliphatic and aromatic hydrocarbons as well as tetrahydrofuran
Phosphonium salts and processes for production of and uses for the same, and phosphines deriving the same and processes for production of the phosphines
申请人:KURARAY CO. LTD,
公开号:US20020183196A1
公开(公告)日:2002-12-05
Phosphonium salts represented by the general formula (I)
1
wherein R
1
and R
2
each represents a phenyl group which may be substituted by a lower alkyl group, R
3
represents a phenylene group which may be substituted by a lower alkyl group, R
7
and R
8
each represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms which may be substituted and R
9
represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms which may be substituted; processes for producing the same and uses for the same; phosphines providing the same, and processes for producing said phosphines.
3-(Alkynylelkyloxy)cephalosporin antibiotics and the intermediates therefor are disclosed. Pharmaceutical compositions for the antibiotics are also disclosed.
Epoxy resin molding material for sealing and electronic component device
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US10662315B2
公开(公告)日:2020-05-26
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.