Photosensitive resin composition and photosensitive element using the resin composition
申请人:Nichigo Morton Co Ltd
公开号:EP0919870A1
公开(公告)日:1999-06-02
A photosensitive resin composition and a photosensitive element using the resin composition with excellent sensitivity and adhesion as well as high resolution and plating resistance. A photosensitive resin composition comprises (A) a polymer carrying carboxyl groups, (B) a compound carrying at least one ethylene-based unsaturated group in the molecule, and (C) a photopolymerization initiator. Component (B) contains at least 60 wt.% of methacrylate (B1), carrying at least one ethylene-based unsaturated group, with respect to the total amount of component (B). The amount of component (C) is in the range of 0.01-20 weight parts per 100 weight parts of components (A) (B), and components (C) contains 2-5 weight parts of lophine dimer (C1) and 0.1-2.0 weight parts of triphenylphosphine (C2) per 100 weight parts of components (A) (B).
一种光敏树脂组合物和使用该树脂组合物的光敏元件,具有优异的灵敏度和附着力以及高分辨率和耐电镀性。光敏树脂组合物包括:(A) 含有羧基的聚合物;(B) 分子中含有至少一个乙烯基不饱和基团的化合物;(C) 光聚合引发剂。相对于组分(B)的总量,组分(B)含有至少 60 重量百分比的甲基丙烯酸酯(B1),其中至少含有一个乙烯基不饱和基团。组分(C)的用量为每 100 重量份组分(A)(B)0.01-20 重量份,组分(C)含有每 100 重量份组分(A)(B)2-5 重量份的洛芬二聚体(C1)和 0.1-2.0 重量份的三苯基膦(C2)。