3-acetoxy-1-methylcyclohexane | 22597-21-3

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 3-acetoxy-1-methylcyclohexane
• 英文别名: M-Cresyl acetate；3-Methylcyclohexyl acetate；(3-methylcyclohexyl) acetate
• CAS: 22597-21-3
• 化学式: C₉H₁₆O₂
• mdl: MFCD00137564
• 分子量: 156.225
• InChiKey: POTQUGZZORQESZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  11
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.888
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  3-甲基环己醇 在 甲基碘化镁 、 乙醚 作用下， 生成 3-acetoxy-1-methylcyclohexane
  参考文献：
  名称：

  Stadnikow, Chemische Berichte, 1924, vol. 57, p. 1

  摘要：

  DOI：

文献信息

• Meerwein–Ponndorf–Verley-type reductive acetylation of carbonyl compounds to acetates by lanthanide complexes in the presence of isopropenyl acetate
  作者：Yasushi Nakano、Satoshi Sakaguchi、Yasutaka Ishii

  DOI：10.1016/s0040-4039(00)00012-5

  日期：2000.3

  Meerwein–Ponndorf–Verley-type reductive acetylation of carbonyl compounds to acetates was successfully carried out in the presence of isopropenyl acetate under the influence of a catalytic amount of Ln(OiPr)3 at room temperature. Various carbonyl compounds were converted into the corresponding acetates in fair to good yields.

  在室温下，在催化量Ln（O i Pr）3的影响下，在乙酸异丙烯酯的存在下，成功实现了Meerwein-Ponndorf-Verley型羰基化合物还原为乙酸的乙酰基化反应。各种羰基化合物均以适当的收率转化为相应的乙酸盐。
• [EN] NEW METHODS FOR HYDRODEALKENYLATION<br/>[FR] NOUVEAUX PROCÉDÉS D'HYDRODÉALCÉNYLATION
  申请人：P2 SCIENCE INC

  公开号：WO2021257922A1

  公开（公告）日：2021-12-23

  The present disclosure pertains to new methods of performing a hydrodealkenylation of monounsaturated alcohols, thiols, and derivatives thereof, such as terpenes and derivatives, comprising ozonolysis and quenching using a sulfinic acid or sulfinic acid salt.

  本公开涉及一种通过臭氧化和熄灭使用亚磺酸或亚磺酸盐的新方法，对单不饱和醇，硫醇及其衍生物，如萜类物质和衍生物进行脱烯基化反应。
• Curable resin composition and cured products
  申请人：JAPAN SYNTHETIC RUBBER CO., LTD.

  公开号：EP0844283A1

  公开（公告）日：1998-05-27

  A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

  一种可固化树脂组合物，包括(A)有机硅烷化合物的水解物或部分缩合物，或二者；(B)至少一种化合物，选自由具有可水解硅基或羧酸酐基或二者皆有的聚酰胺和具有可水解硅基或羧酸酐基或二者皆有的聚酰亚胺组成的组；(C) 与选自锆、钛和铝组成的金属的螯合物或烷氧基化合物，或螯合物和烷氧基化合物。这种树脂组合物可以在不产生裂缝的情况下固化和制造成固化产品，例如具有低介电常数、高耐热性和防潮性、与各种基底材料的良好粘合性、优异的电绝缘性能和低吸湿性的半导体器件。使用这种可固化树脂组合物作为绝缘膜的半导体器件耗电量低、工作速度快、可靠性高。
• Hirano, Masao; Nakamura, Kouji; Morimoto, Takashi, Journal of the Chemical Society. Perkin transactions II, 1981, p. 817 - 820
  作者：Hirano, Masao、Nakamura, Kouji、Morimoto, Takashi

  DOI：——

  日期：——
• Senderens; Aboulenc, Comptes Rendus Hebdomadaires des Seances de l'Academie des Sciences, 1912, vol. 155, p. 170,1013, 1254
  作者：Senderens、Aboulenc

  DOI：——

  日期：——

表征谱图