[EN] COPPER-CONTAINING POLYMERIC COMPOSITIONS<br/>[FR] COMPOSITIONS POLYMÈRES CONTENANT DU CUIVRE
申请人:EASTMAN KODAK CO
公开号:WO2016186864A1
公开(公告)日:2016-11-24
Copper-containing compositions can be provided in articles on a suitable substrate. Such compositions can include either reducible copper ions or copper nanoparticles complexed with a water-soluble reactive polymer or a water-insoluble crosslinked polymer derived from the water-soluble reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The various articles and electrically -conductive materials can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxy 1, lactam, phosphonic acid, or carboxylic acid group.
含铜组分可以被提供在适合的基板上的物品中。这种组分可以包括可还原的铜离子或与水溶性活性聚合物或从水溶性活性聚合物衍生的水不溶性交联聚合物络合的铜纳米粒子。活性聚合物可以通过适当的辐照进行交联,以提供含铜的水不溶性络合物。各种物品和电导材料可以组装在电子器件中。活性聚合物具有大于1摩尔%的重复单元,包括磺酸或磺酸盐基团,至少5摩尔%的重复单元,包括通过[2+2]光环加成能够交联的侧链基团,以及可选地至少1摩尔%的重复单元,包括侧链酰胺、胺、羟基、内酰胺、膦酸或羧酸基团。