申请人:Ebara-Udylite Co., Ltd.
公开号:EP1959029A1
公开(公告)日:2008-08-20
There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I):
wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
提供了将催化剂金属选择性地吸附到阴离子基团(如羧基)上,从而在非导电树脂上选择性地形成金属膜的技术,包括由下式(I)表示的钯络合物:
其中 L 代表亚烷基,R 代表氨基或胍基,或其结构异构体;含有该络合物作为活性组分的无电解电镀催化剂应用处理液;以及在非导电树脂上形成金属电镀膜的方法,包括使用该处理液对表面具有阴离子基团的非导电树脂进行催化剂吸附处理,然后进行还原处理、无电解金属电镀和金属电镀。