A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
一种膦
铵化合物、其制备方法、包含该化合物的环氧
树脂组合物以及用该化合物封装的半导体器件,该化合物由式子1表示: