2,4-dimethyl-thioxanthene | 17394-12-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并噻喃类
• 英文名称: 2,4-dimethyl-thioxanthene
• 英文别名: 2,4-Dimethyl-thioxanthen；2,4-dimethyl-9H-thioxanthene
• CAS: 17394-12-6
• 化学式: C₁₅H₁₄S
• 分子量: 226.342
• InChiKey: UFSXXNITYKZOEK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.7
• 重原子数：
  16
• 可旋转键数：
  0
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  25.3
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2,4-dimethyl-thioxanthene 在 1,8-二氮杂双环[5.4.0]十一碳-7-烯 正丁基锂 、 溶剂黄146 作用下， 以 甲醇 、 二氯甲烷 、 苯 为溶剂， 反应 28.75h， 生成 9-ethyl-2,4-dimethyl-9-(N-p-toluenesulfonamido)thioxanthene
  参考文献：
  名称：

  Synthesis, stereochemistry, and base-catalyzed rearrangement of 9-alkyl-2,4-dimethylthioxanthene-N-(p-toluenesulfonyl)sulfilimines

  摘要：

  DOI：

  10.1021/jo01303a013
• 作为产物：
  描述：

  2,4-二甲基噻吨-9-酮 在 硼烷四氢呋喃络合物 作用下， 以 四氢呋喃 为溶剂， 以89.7 %的产率得到2,4-dimethyl-thioxanthene
  参考文献：
  名称：

  肟酯光引发剂、其制备方法及应用

  摘要：

  本发明提供了一种肟酯光引发剂、其制备方法及应用。该肟酯光引发剂具有通式(I)所示结构，R1、R1’、R3、R4分别独立地选自一价有机基团，可选地，R1和R1’互相环合；m个R2分别独立地选自卤素原子、硝基、氰基、羟基、羧基、酰基、磺基、取代或未取代的C1～C20的直链或支链烷基、取代或未取代的C3～C20的环烷基、取代或未取代的C4～C20的环烷基烷基、取代或未取代的C4～C20的烷基环烷基、取代或未取代的C5～C20芳基；m为0、1、2、3或4；n为1或0。本发明的肟酯光引发剂可以方便地应用于紫外光固化体系，尤其适合于汞灯固化，能够显著提升光刻胶的折射率和图案的分辨率，易合成、成本低。#imgabs0#

  公开号：

  CN117986231A

文献信息

• Synthesis, stereochemistry, and rearrangement of thioxanthen-10-io-(bismethoxycarbonyl)methanides and their 9-alkyl derivatives
  作者：Yasumitsu Tamura、Chisato Mukai、Noriko Nakajima、Masazumi Ikeda、Masaru Kido

  DOI：10.1039/p19810000212

  日期：——

  Thioxanthen-10-io- and 2,4-dimethylthioxanthen-10-io-(bismethoxycarbonyl)methanides and their 9-alkyl derivatives were synthesised by the reaction of the corresponding thioxanthens with bismethoxycarbonylcarbene generated thermally from dimethyl diazomalonate in the presence of copper(II) sulphate. The stereochemistry of the ylides was determined by examination of the n.m.r. spectra and by X-ray analysis

  噻吨-10- IO-和2,4- dimethylthioxanthen -10- IO-（bismethoxycarbonyl）methanides及其9-烷基衍生物通过用从在铜的存在下二甲基diazomalonate热产生bismethoxycarbonylcarbene相应thioxanthens的反应合成（II）硫酸盐。通过检查核磁共振谱和通过反式的X射线分析确定叶立德的立体化学-9-乙基-2,4-二甲基噻吨黄-10--10-（双甲氧基羰基）甲烷。在存在1,8-二氮杂双环[5.4.0]十一碳-7-烯（DBU）的情况下，将甲苯磺酸flu回流在甲苯中会导致重排成相应的9-（双甲氧基羰基甲基）噻吨，但9-异丙基衍生物除外。即使在回流的二甲苯中也很稳定。讨论了重排的机制。
• METHOD FOR PRODUCTION OF ORGANIC-INORGANIC COMPLEX, ORGANIC-INORGANIC COMPLEX, AND POLYMERIC COMPOSITE MATERIAL
  申请人：Tamura Kenji

  公开号：US20090227715A1

  公开（公告）日：2009-09-10

  Disclosed are: a method for production of an organic-inorganic complex by intercalation of a positively charged organic compound between layers of a non-swellable layered silicate which is believed to be difficult to achieve under convenient conditions; the organic-inorganic complex; and a layered silicate/polymer nanocomposite using the organic-inorganic complex. The method comprises: step (I) wherein a hydrous layered silicate having a hydroxyl group in its crystalline structure is heat-treated at a temperature not higher than 1,200° C. and lower than the phase transition temperature of the silicate to dehydrate the silicate; and step (II) wherein the dehydrated layered silicate is contacted with an aqueous solution of a positively charged organic compound.

  本发明涉及一种通过将正电有机化合物插层到非膨胀层状硅酸盐的层间来制备有机-无机复合物的方法，该方法被认为在方便条件下很难实现；所述有机-无机复合物；以及使用所述有机-无机复合物的层状硅酸盐/聚合物纳米复合材料。该方法包括：步骤（I），其中将具有晶体结构中羟基的水合层状硅酸盐在不高于1,200℃且低于硅酸盐相变温度的温度下进行热处理以脱水硅酸盐；以及步骤（II），其中将脱水的层状硅酸盐与正电有机化合物的水溶液接触。
• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same
  申请人：Ishigaki Satoru

  公开号：US20070218305A1

  公开（公告）日：2007-09-20

  There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH 2 ═CH—COO—R—NCO  (1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).

  本发明提供了一种新型的光敏树脂组合物，其固化膜具有充足的柔韧性，并且产生的绝缘保护涂层具有优异的焊接耐热性，热降解耐性和无电镀金耐性。本发明所述的光敏树脂组合物包括：含有尿素丙烯酸酯化合物（A）和除所述尿素丙烯酸酯化合物（A）以外的具有乙烯基不饱和基团的化合物（B）的光聚合组分，热固性树脂（C），光聚合引发剂（D）和热聚合催化剂（E）；其中，所述尿素丙烯酸酯化合物（A）是以下一般式（1）的异氰酸酯化合物（a-1）和多羟基化合物（a-2）的反应产物：CH2═CH—COO—R—NCO  （1）（其中，R代表具有1至30个碳原子的碳氢基团）。
• Phosphazene compound, photosensitive resin composition and use thereof
  申请人：Okada Koji

  公开号：US20060142542A1

  公开（公告）日：2006-06-29

  Disclosed is a phosphazene compound and a photosensitive resin composition. The phosphazene compound is obtained by reacting a phenoxyphosphazene compound (A-1) having a phenolic hydroxyl group and/or a cross-linked phenoxyphosphazene compound (A-2) obtained by cross-linking the phenoxyphosphazene compound (A-1) with an epoxy compound (B) having an unsaturated double bond and/or an isocyanate compound (C), wherein the phosphazene compound has an unsaturated double bond in its molecule. The photosensitive resin composition includes at least: a soluble polyimide resin (G-1) having a carboxyl group and/or a hydroxyl group and is soluble in an organic solvent, as the polyimide resins (G); and a phenoxyphosphazene compound (H-1) having a phenolic hydroxyl group and/or a cross-linked phenoxyphosphazene compound (H-2), which is obtained by cross-linking the phenoxyphosphazene compound (H-1) and has at least one phenolic hydroxyl group, as the phosphazene compound (H), and the photosensitive resin composition further includes a (meth)acrylic compound (L).

  本发明公开了一种膦氮化合物和一种感光树脂组合物。膦氮化合物是由具有酚羟基的苯氧基膦氮化合物（A-1）和/或通过将苯氧基膦氮化合物（A-1）与具有不饱和双键的环氧化合物（B）和/或异氰酸酯化合物（C）交联而得到的交联苯氧基膦氮化合物（A-2）反应得到的，其中膦氮化合物分子中具有不饱和双键。光敏树脂组合物至少包括具有羧基和/或羟基并可溶于有机溶剂的可溶性聚酰亚胺树脂 (G-1)，如聚酰亚胺树脂 (G)；和具有酚羟基的苯氧基膦氮化合物（H-1）和/或交联苯氧基膦氮化合物（H-2），后者通过交联苯氧基膦氮化合物（H-1）而得到，具有至少一个酚羟基，作为膦氮化合物（H），感光树脂组合物还包括（甲基）丙烯酸化合物（L）。