Bennett, John E.; Brunton, George; Forrester, Alexander R., Journal of the Chemical Society. Perkin transactions II, 1983, # 10, p. 1481 - 1484
作者:Bennett, John E.、Brunton, George、Forrester, Alexander R.、Fullerton, Joseph D.
DOI:——
日期:——
FORRESTER, A. R.;FULLERTON, J. D.;MCCONNACHIE, G., J. CHEM. SOC. PERKIN TRANS., 1983, N 8, 1759-1764
作者:FORRESTER, A. R.、FULLERTON, J. D.、MCCONNACHIE, G.
DOI:——
日期:——
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME
申请人:Takeda Sayaka
公开号:US20140005318A1
公开(公告)日:2014-01-02
Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.