THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND
申请人:KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
公开号:US20180155370A1
公开(公告)日:2018-06-07
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
本发明涉及一种热固性烷氧基硅基化合物(以下简称“烷氧基硅基化合物”),其具有两个或两个以上的烷氧基硅基团,在复合材料中表现出优异的耐热特性;包括该烷氧基硅基化合物的组合物和固化产物;其用途;以及制备烷氧基硅基化合物的方法。根据本发明的一种烷氧基硅基化合物的组合物显示出改善的耐热特性,即降低烷氧基硅基化合物组合物的CTE并且不显示玻璃转变温度(以下简称“Tg-less”)的效果。此外,根据本发明的一种烷氧基硅基化合物的固化产物由于烷氧基硅基团表现出优异的阻燃性能。