The present invention relates to novel condensation polymers where N,N*-disubstituted disulfonamides are copolymerized with an organic acid dihalide such as dicarboxylic acid dichlorides, disulfonic acid dichlorides, bis chloroformates, diphosphoryl acid dichlorides, diphosphonyl acid dichlorides, or phosgene or with diisocyanates. The polymers obtained are thermoplastic and useful in molding and extrusion application.
本发明涉及新型缩聚聚合物,其中N,N* -二取代二磺酰胺与有机酸二卤代物(如二
羧酸二
氯化物,二
磺酸二
氯化物,双
氯甲酸酯,二
磷酸二
氯化物,
二膦酸二
氯化物或
光气)或二
异氰酸酯共聚。所得到的聚合物是热塑性的,可用于模塑和挤出应用。