An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 &mgr;m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.
一种绝缘材料,包括环
氧烷基
聚合物,具体地说,这是一种用于高密度组装板的层间绝缘材料,其间层连接的经孔直径最多为200微米,包括至少50摩尔%来自环
氧烷基单体的
重复单元的环
氧烷基
聚合物; 由可固化
树脂组成的可干膜,其
聚合物的数量平均分子量在1,000至1,000,000之间(通过凝胶渗透色谱法测量),以及硬化剂; 以及通过在
金属箔的一侧形成环
氧烷基
聚合物膜而获得的
树脂附着
金属箔。利用这些材料制成的层压板,多层层压板和堆叠多层层压板以及其生产工艺。