Heat-curable compositions suitable for use in reaction injection moulding processes comprise:
(1) an epoxy compound having on average more than one epoxy group per molecule;
(2) an amino compound containing at least three amino hydrogen atoms per molecule, as curing agent.
(3) a Group I or II metal salt, as catalyst, and
(4) a polyalkylene ether glycol.
An ethylenically unsaturated monomer and a peroxide free-radical initiator may also be present. The compositions may be moulded and cured by application of heat to produce formed articles.
适用于反应注塑工艺的热固化组合物包括:(1) 一种环氧化合物,平均每个分子含有一个以上的环氧基团;(2) 一种
氨基化合物,每个分子至少含有三个
氨基氢原子,作为固化剂;(3) 一种 I 族或 II 族
金属盐,作为催化剂;(4) 一种聚亚烷基醚二醇。 还可能含有一种
乙烯基不饱和单体和一种过氧化物自由基
引发剂。 这些组合物可以通过加热进行模塑和固化,以生产成型物品。