申请人:Avary Holding (Shenzhen) Co., Limited.
公开号:US10299367B2
公开(公告)日:2019-05-21
A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.
电路板包括挠性板、复合薄膜和铜层。复合薄膜形成于挠性电路板上,并限定了至少一个通孔。复合薄膜包括具有活性表面的基底层,以及通过在活性表面涂覆导电聚合物而形成的导电层。导电聚合物由液晶单体、银络合物、引发剂、催化剂和溶剂组成的混合物制成,混合物加热后进行原子转移自由基聚合。铜层覆盖导电层和每个至少一个通孔的内壁。铜层通过通孔与柔性基底电连接。