1,3-di(t-butoxycarbonyl)-5-acryloyloxyadamantane | 251563-08-3

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 1,3-di(t-butoxycarbonyl)-5-acryloyloxyadamantane
• 英文别名: Ditert-butyl 5-prop-2-enoyloxyadamantane-1,3-dicarboxylate
• CAS: 251563-08-3
• 化学式: C₂₃H₃₄O₆
• 分子量: 406.519
• InChiKey: DWAAFBYDPUVXAE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  29
• 可旋转键数：
  9
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.78
• 拓扑面积：
  78.9
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• Polymeric compound and resin composition for photoresist
  申请人：——

  公开号：US20020169266A1

  公开（公告）日：2002-11-14

  A photoresist polymeric compound includes a monomer unit represented by following Formula (I): 1 The polymeric compound may further include at least one of monomer units represented by following Formulae (IIa) to 2 wherein R 1 , R 13 , R 14 and R 15 are each a hydrogen atom or methyl group; R 2 and R 3 are each a hydrocarbon group having from 1 to 8 carbon atoms; R 4 , R 5 and R 6 are each a hydrogen atom, hydroxyl group or a methyl group; R 7 and R 8 are each a hydrogen atom, hydroxyl group or —COOR 9 group, where R 9 is a t-butyl group, 2-tetrahydropyranyl group, etc.; R 10 and R 11 are each a hydrogen atom, hydroxyl group or oxo group; R 12 is a hydrocarbon group having a tertiary carbon atom at a bonding site with an oxygen atom indicated in the formula; R 16 is a t-butyl group, 2-tetrahydropyranyl group, etc.; and n denotes an integer from 1 to 3. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.

  一种光阻聚合物化合物包括以下式(I)所表示的单体单元：1该聚合物化合物还可以包括以下式(IIa)至(IIb)所表示的至少一种单体单元中的至少一种：其中，R1、R13、R14和R15均为氢原子或甲基基团；R2和R3均为具有1至8个碳原子的碳氢基团；R4、R5和R6均为氢原子、羟基或甲基基团；R7和R8均为氢原子、羟基或-COOR9基团，其中R9为叔丁基基团、2-四氢呋喃基团等；R10和R11均为氢原子、羟基或酮基；R12为具有在公式中指示的氧原子与三级碳原子成键位的碳氢基团；R16为叔丁基基团、2-四氢呋喃基团等；n表示1至3的整数。该光阻聚合物化合物可以表现出对基材的高粘附性，并可以高精度地形成细小图案。
• COMPOUNDS FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
  申请人：Daicel Chemical Industries, Ltd.

  公开号：EP0999474A1

  公开（公告）日：2000-05-10

  The photoresist resin composition comprises a polymer having an adamantane skeleton represented by the following formula and a photoactive acid precursor: wherein R1 represents a hydrogen atom or a methyl group; R2, R3, and R4 are the same or different from each other, each representing a hydrogen atom, a halogen atom, an alkyl group, a hydroxyl group, a hydroxylmethyl group, a carboxyl group, a functional group which forms a hydroxyl group, a hydroxymethyl group or a carboxyl group by elimination with an acid; at least one of the substituents R2 to R4 is the functional group defined above; X represents an ester bond or an amide bond; and each of m and n is 0 or 1. The above photoresist resin composition is highly resistant to an etching solution, solubilizable by irradiation with light, and capable of giving minute patterns.

  光致抗蚀剂树脂组合物由具有下式所示金刚烷骨架的聚合物和光活性酸前体组成： 其中 R1 代表氢原子或甲基；R2、R3 和 R4 彼此相同或不同，各自代表氢原子、卤素原子、烷基、羟基、羟甲基、羧基、通过与酸消去形成羟基、羟甲基或羧基的官能团；取代基 R2 至 R4 中至少有一个是上文定义的官能团； X 代表酯键或酰胺键；以及 m 和 n 均为 0 或 1。 上述光刻胶树脂组合物对蚀刻溶液有很强的抵抗力，在光照射下可溶解，并能产生微小的图案。
• POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
  申请人：Daicel Chemical Industries, Ltd.

  公开号：EP1172694A1

  公开（公告）日：2002-01-16

  A photoresist polymeric compound includes a monomer unit represented by following Formula (I) : The polymeric compound may further include at least one of monomer units represented by following Formulae (IIa) to (IIg): wherein R1, R13, R14 and R15 are each a hydrogen atom or methyl group; R2 and R3 are each a hydrocarbon group having from 1 to 8 carbon atoms; R4, R5 and R6 are each a hydrogen atom, hydroxyl group or a methyl group; R7 and R8 are each a hydrogen atom, hydroxyl group or -COOR9 group, where R9 is a t-butyl group, 2-tetrahydropyranyl group, etc.; R10 and R11 are each a hydrogen atom, hydroxyl group or oxo group; R12 is a hydrocarbon group having a tertiary carbon atom at a bonding site with an oxygen atom indicated in the formula; R16 is a t-butyl group, 2-tetrahydropyranyl group, etc.; and n denotes an integer from 1 to 3. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.

  一种光致抗蚀剂聚合化合物包括下式（I）所代表的单体单元： 该聚合化合物还可进一步包括下式（IIa）至（IIg）所代表的单体单元中的至少一种： 其中 R1、R13、R14 和 R15 各为氢原子或甲基；R2 和 R3 各为具有 1 至 8 个碳原子的烃基；R4、R5 和 R6 各为氢原子、羟基或甲基；R7 和 R8 各为氢原子、羟基或-COOR9 基，其中 R9 为叔丁基、2-四氢吡喃基等。R10 和 R11 分别是氢原子、羟基或氧代基团；R12 是烃基，其上的三级碳原子与式中所示的氧原子成键；R16 是叔丁基、2-四氢吡喃基等；n 表示 1 至 3 的整数。 这种光致抗蚀剂聚合物化合物对基底有很高的附着力，并能高度精确地形成精细图案。
• Compounds for photoresist and resin composition for photoresist
  申请人：Daicel Chemical Industries, Ltd.

  公开号：EP1443363A2

  公开（公告）日：2004-08-04

  A photoresist adamantane-series monomer represented by the following formula (1b):    wherein R11 represents a hydrogen atom or a methyl group; R12, R13, and R14 are the same or different from each other, each representing a hydrogen atom, an alkyl group, or a hydroxyl group and at least one of the substituents R12 to R14 is a hydroxyl group; X represents a connecting group; and m and n individually represent 0 or 1.

  由下式(1b)代表的光阻金刚烷系列单体： 其中 R11 代表氢原子或甲基；R12、R13 和 R14 彼此相同或不同，各自代表氢原子、烷基或羟基，且 R12 至 R14 的取代基中至少有一个是羟基；X 代表连接基团；m 和 n 分别代表 0 或 1。
• Photoresist resin composition and method for forming a pattern
  申请人：Daicel Chemical Industries, Ltd.

  公开号：EP0999474B1

  公开（公告）日：2011-11-23