EEW261 | 57862-49-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: EEW261
• 英文别名: Bisphenol A trimer diglycidyl ether；1-[4-[2-[4-[2-hydroxy-3-[4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]propoxy]phenyl]propan-2-yl]phenoxy]-3-[4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]propan-2-ol
• CAS: 57862-49-4
• 化学式: C₅₇H₆₄O₁₀
• 分子量: 909.129
• InChiKey: DQAHDHIIRYLNQD-UHFFFAOYSA-N

物化性质

• 沸点：
  974.5±65.0 °C(Predicted)
• 密度：
  1.189±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  11.7
• 重原子数：
  67
• 可旋转键数：
  24
• 环数：
  8.0
• sp3杂化的碳原子比例：
  0.37
• 拓扑面积：
  121
• 氢给体数：
  2
• 氢受体数：
  10

反应信息

• 作为反应物：
  描述：

  EEW261 、 5-溴-1-戊烯 在 sodium hydride 作用下， 以 N,N-二甲基甲酰胺 、 mineral oil 为溶剂， 反应 24.0h， 生成 2-[[4-[2-[4-[3-[4-[2-[4-[3-[4-[2-[4-(Oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]-2-pent-4-enoxypropoxy]phenyl]propan-2-yl]phenoxy]-2-pent-4-enoxypropoxy]phenyl]propan-2-yl]phenoxy]methyl]oxirane
  参考文献：
  名称：

  EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, COMPOSITION AND HARDENED MATERIAL COMPRISING SAME, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

  摘要：

  公开号：

  EP2835373B1

文献信息

• SILANE FUNCTIONALIZED COMPOUNDS AND COMPOSITIONS THEREOF
  申请人：Hexion Inc.

  公开号：US20160090439A1

  公开（公告）日：2016-03-31

  Compositions comprising Silane functionalized compounds are provided. In one embodiment, the silane functionalized compounds include an epoxy resin derived backbone having silane functional groups pendant to the backbone or serving as end caps. The compositions comprising silane functionalized compounds may be utilized in a variety of applications including in coating formulations, adhesive formulations, composite materials, and combinations thereof.

  提供了包含硅烷官能化化合物的组合物。在一种实施例中，硅烷官能化化合物包括由硅烷官能基悬挂于骨架或作为末端盖的环氧树脂衍生骨架。包含硅烷官能化合物的组合物可以用于各种应用，包括涂层配方、粘合剂配方、复合材料和其组合。
• Silane functionalized compounds and compositions thereof
  申请人：Hexion Inc.

  公开号：US10040896B2

  公开（公告）日：2018-08-07

  Compositions comprising Silane functionalized compounds are provided. In one embodiment, the silane functionalized compounds include an epoxy resin derived backbone having silane functional groups pendant to the backbone or serving as end caps. The compositions comprising silane functionalized compounds may be utilized in a variety of applications including in coating formulations, adhesive formulations, composite materials, and combinations thereof.

  本文提供了由硅烷官能化化合物组成的组合物。在一个实施方案中，硅烷官能化化合物包括环氧树脂衍生骨架，骨架上悬挂有硅烷官能团或作为端盖。包含硅烷官能化化合物的组合物可用于多种应用，包括涂料配方、粘合剂配方、复合材料及其组合。
• Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group
  申请人：KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

  公开号：US10689482B2

  公开（公告）日：2020-06-23

  The present invention relates to an alkoxysilylated epoxy compound, a composite exhibiting good heat resistance properties, low CTE and high glass transition temperature and not requiring a coupling agent, a composition including the same, a cured product formed of the composition, a use of the cured product, and a method of preparing the epoxy compound having alkoxysilyl group. An epoxy compound having an epoxy group and an alkoxysilyl group, a composition including the epoxy compound, a curing agent, a filler and/or a reaction catalyst, a cured product of the composition, and a use of the composition including an electronic part are provided. In a composite and/or cured product, the epoxy composition exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg-less. The cured product exhibits good flame retardant properties by the introduction of the alkoxysilyl group.

  本发明涉及一种烷氧基硅烷基化环氧化合物、一种具有良好耐热性能、低CTE和高玻璃化转变温度且无需偶联剂的复合材料、一种包括该环氧化合物的组合物、一种由该组合物形成的固化产物、该固化产物的用途以及一种制备具有烷氧基硅烷基的环氧化合物的方法。本发明提供了一种具有环氧基团和烷氧基硅烷基的环氧化合物、一种包括该环氧化合物、固化剂、填料和/或反应催化剂的组合物、该组合物的固化产物以及该组合物的用途（包括电子部件）。在复合材料和/或固化产品中，环氧树脂组合物具有更好的耐热性能、更低的热膨胀系数和更高的玻璃化转变温度或 Tg-less。通过引入烷氧基硅烷基团，固化产品具有良好的阻燃性能。
• Cure properties of alkoxysilylated epoxy resin systems with hardeners for semiconductor packaging materials
  作者：Whan Gun Kim、Hyunaee Chun

  DOI：10.1080/15421406.2016.1201388

  日期：2016.9

  The alkoxysilylated bisphenol A epoxy resins, dsiglycidylether of bisphenol A with 3-triethoxysilyl propyl carbamate(DGEBA-TESPC) and diglycidyl ether of bisphenol A with 3-triethoxysilyl propyl(DGEBA-TESP) are synthesized, and the effect of alkoxysilyl group on the cure properties of these resin systems with phenol novolac(PN) hardener and triphenylphosphine(TPP) catalyst are investigated. The cure kinetics of these systems were analyzed by dynamic and isothermal data from the DSC experiments, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. Thermal expansion coefficients of these epoxy systems were obtained by mean of TMA measurement. These resin systems show autocatalytic cure kinetics phenomena and the conversion reaction rate of DGEBA-TESP hybrid system with PN hardener is slightly higher than DGEBA-TESPC system. The DGEBA-TESP resin system has lower frequency factor and lower activation energy than DGEBA-TESPC resin system in k(1) reaction rate constant. However, it shows higher frequency factor and higher activation energy than that in k(2) reaction rate constant. The thermal property of glass fiber composites of DGEBA-TESPC and DGEBA-TESP is observed to be improved than DGEBA, which may arise from the facile interaction of grafted alkoxysilyl group with glass fiber.
• US4162246A
  申请人：——

  公开号：US4162246A

  公开（公告）日：1979-07-24