聚(2-羟基乙基甲基丙烯酸酯-甲基丙烯酸) | 31693-08-0

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 中文名称: 聚(2-羟基乙基甲基丙烯酸酯-甲基丙烯酸)
• 英文名称: 2-Hydroxyethyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid
• CAS: 31693-08-0
• 化学式: C10H16O5
• 分子量: 216.23
• InChiKey: NORSCOJMIBLOFM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.75
• 重原子数：
  15
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  83.8
• 氢给体数：
  2
• 氢受体数：
  5

文献信息

• Heat storing material, composition thereof and their use
  申请人：Sano Masahiro

  公开号：US20050106392A1

  公开（公告）日：2005-05-19

  A heat-accumulative material composed of a polymer or oligomer having a melting point of −10 to 100° C. and latent heat of 30 J/g or more for use around a body, and heat-accumulative composition comprising the same heat-accumulative material. The heat-accumulative material tends to be kept at a constant temperature more effectively by absorbing heat as ambient temperature increases to melt, and releasing heat as ambient temperature decreases to solidify, to moderate the effect of changed ambient temperature, and thereby to exhibit the function as a heat-accumulative material. They have a sufficiently high viscosity, preventing the heat-accumulative material from flowing out even when it is molten. Each of the heat-accumulative material and composition can be made into a heat-accumulative film or sheet, laminate, molded article, composite fiber and cloth which can be suitably used around a body.

  一种热积累材料，由具有熔点在-10至100°C之间且潜热为30 J/g或更高的聚合物或寡聚物组成，用于围绕身体，并且包含该热积累材料的热积累组合物。当环境温度升高以熔化时，吸收热量并释放热量以固化，以更有效地保持热积累材料的恒定温度，以缓解环境温度变化的影响，从而发挥作为热积累材料的功能。它们具有足够高的粘度，即使在熔化时也可以防止热积累材料流出。每种热积累材料和组合物都可以制成热积累膜或片，层压板，模压件，复合纤维和布料，可适当地用于身体周围。
• Wiring-connecting material and wiring-connected board production process using the same
  申请人：——

  公开号：US20040214979A1

  公开（公告）日：2004-10-28

  The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

  本发明提供了一种连接线材料，包括2至75重量份的聚氨酯树脂，30至60重量份的自由基聚合物质和0.1至30重量份的固化剂，该固化剂能在加热时产生自由基，以及使用该连接线材料制备连接线板的方法。本发明的连接线材料还可以包含成膜材料和/或导电粒子。
• Infra red absorbing compounds and their use in photoimageable elements
  申请人：——

  公开号：US20040180285A1

  公开（公告）日：2004-09-16

  Infrared absorbing compounds in which the anion is selected from the group consisting of 5-isatinsulfonate, 10-camphorsulfonate, and 4,5-dihydroxy-1,3-benzenedisulfonate are disclosed. Negative-working imageable elements containing these compounds have improved dot stability.

  本发明揭示了阴离子选自5-异吲哚磺酸盐、10-樟脑磺酸盐和4,5-二羟基-1,3-苯二磺酸盐等组成的红外吸收化合物。包含这些化合物的负向感光元件具有改善的点稳定性。
• POLYMERIZABLE COMPOSITION, COLOR FILTER, AND METHOD OF PRODUCING THE SAME, SOLID-STATE IMAGING DEVICE, AND PLANOGRAPHIC PRINTING PLATE PRECURSOR, AND NOVEL COMPOUND
  申请人：Makino Masaomi

  公开号：US20120176571A1

  公开（公告）日：2012-07-12

  Disclosed is a photopolymerizable composition which contains a photopolymerization initiator (A) that has a partial structure represented by the following Formula (1) and a polymerizable compound (B). In General formula (1), R 3 and R 4 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group or an alkoxy group; R 3 and R 4 may form a ring with each other; and X represents OR 5 , SR 6 , or NR 17 R 18 . The photopolymerizable composition is capable of forming a cured film that has high sensitivity, excellent intra-membrane curability and excellent adhesion to a support. The cured film is able to maintain a patterned shape even during post-heating after development and has good pattern formability, while coloring due to heating with passage of time being suppressed.

  本发明公开了一种光聚合组合物，其包含具有以下式（1）所表示的部分结构的光聚合引发剂（A）和可聚合化合物（B）。在通式（1）中，R3和R4各自独立地表示氢原子、烷基、烯基、炔基、芳基、杂芳基或烷氧基；R3和R4可以互相形成环；X表示OR5、SR6或NR17R18。该光聚合组合物能够形成具有高灵敏度、优异的内膜可固化性和与支撑体良好的附着性的固化膜。该固化膜能够在显影后的后热处理期间保持呈图案状，并具有良好的图案成形性，同时抑制由于时间加热而导致的着色。
• WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME
  申请人：Fujinawa Tohru

  公开号：US20100265685A1

  公开（公告）日：2010-10-21

  The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

  本发明提供了一种连线连接材料，包括2至75重量份的聚氨酯树脂，30至60重量份的自由基聚合物质和0.1至30重量份的固化剂，该固化剂在加热时能够产生自由基，并且可以使用该连线连接材料制备连线连接板的生产工艺。本发明的连线连接材料还可以优选地包含成膜材料和/或导电颗粒。