<2>Norborn-5-enyl-essigsaeure-aethylester | 74876-17-8

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: <2>Norborn-5-enyl-essigsaeure-aethylester
• 英文别名: Bicyclo[2.2.1]hept-5-ene-2-acetic acid, ethyl ester, endo-；ethyl 2-(2-bicyclo[2.2.1]hept-5-enyl)acetate
• CAS: 74876-17-8
• 化学式: C₁₁H₁₆O₂
• 分子量: 180.247
• InChiKey: AEQDHLBSBIYNNI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  13
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.73
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• RING-OPENING METATHESIS POLYMERS, PRODUCTS OF HYDROGENATION THEREOF, PROCESS FOR PRODUCTION OF THE SAME AND USES THEREOF
  申请人：Mitsui Chemicals, Inc.

  公开号：EP2045280A1

  公开（公告）日：2009-04-08

  Provided are a ring-opening metathesis polymer and a hydrogenated product thereof that are useful as materials for an optical component, and a method for preparation thereof. The present invention relates to a ring-opening metathesis polymer comprising at least repeating structural units [A] represented by the following General Formula [1] and repeating structural units [B] represented by the following General Formula [2] at a constitutional molar ratio [A]/[B] of 0.1/99.9 to 100/0. The present invention relates to a ring-opening metathesis polymer comprising at least repeating structural units [A] represented by the following General Formula [1] and repeating structural units [B] represented by the following General Formula [2] at a constitutional molar ratio [A]/[B] of 0.1/99.9 to 100/0.

  本发明提供了一种可用作光学元件材料的开环元合成聚合物及其氢化产物，以及制备方法。本发明涉及一种开环元合成聚合物，它至少包含由下式通式[1]表示的重复结构单元[A]和由下式通式[2]表示的重复结构单元[B]，其组成摩尔比[A]/[B]为 0.1/99.9 至 100/0。本发明涉及一种开环嵌段聚合物，它至少包含由下式通式[1]表示的重复结构单元[A]和由下式通式[2]表示的重复结构单元[B]，其组成摩尔比[A]/[B]为 0.1/99.9 至 100/0。
• RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT
  申请人：Mitsui Chemicals, Inc.

  公开号：EP3693793A1

  公开（公告）日：2020-08-12

  Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G') curve and a loss modulus (G") curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30°C to 300°C, a heating rate of 3°C/min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40°C and lower than or equal to 200°.

  本发明提供了一种用于形成底层膜的树脂材料，该底层膜可用于形成多层光刻胶工艺中使用的光刻胶底层膜，该树脂材料包括环烯烃聚合物 (I)、其中，用于形成底层膜的树脂材料的固体粘弹性中的存储模量（G'）曲线和损失模量（G"）曲线的交点温度高于或等于 40°C，且低于或等于 200°C；该固体粘弹性是在测量温度范围为 30°C 至 300°C、加热速率为 3°C/min 和频率为 1 Hz 的条件下，在氮气环境中使用流变仪以剪切模式测得的。
• HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES
  申请人：De Binod B.

  公开号：US20080206667A1

  公开（公告）日：2008-08-28

  An etch resistant thermally curable Underlayer for use in a multiplayer liyhographic process to produce a photolithographic bilayer coated substrate, the composition having: (a) at least one cycloolefin polymer comprising at least one repeating unit of Structure (I), and at least one repeating unit of Structure (II), and optionally at least one repeating unit of Structure (III) with the proviso that neither Structure (I) nor Structure (II) nor Structure (III) contains acid sensitive groups. b) at least one cross-linking agent selected from the group consisting of an amino or phenolic cross-linking agent; c) a least one thermal acid generator (TAG); d) at lest one solvent; and e) optionally, at least one surfactant.
• RING-OPENING METATHESIS POLYMER, HYDROGENATED PRODUCT THEREOF, METHOD FOR PREPARING THE SAME, AND USE THEREOF
  申请人：Sunaga Tadahiro

  公开号：US20090215974A1

  公开（公告）日：2009-08-27

  Provided are a ring-opening metathesis polymer and a hydrogenated product thereof that are useful as materials for an optical component, and a method for preparation thereof. The present invention relates to a ring-opening metathesis polymer comprising at least repeating structural units [A] represented by the following General Formula [1] and repeating structural units [B] represented by the following General Formula [2] at a constitutional molar ratio [A]/[B] of 0.1/99.9 to 100/0. The present invention relates to a ring-opening metathesis polymer comprising at least repeating structural units [A] represented by the following General Formula [1] and repeating structural units [B] represented by the following General Formula [2] at a constitutional molar ratio [A]/[B] of 0.1/99.9 to 100/0.
• THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION
  申请人：De Binod B.

  公开号：US20120178871A1

  公开（公告）日：2012-07-12

  An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composirion being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.