Low-pressure and low-temperature moldable composition and shaped article therefrom
申请人:TAKEDA CHEMICAL INDUSTRIES, LTD.
公开号:EP0598227A1
公开(公告)日:1994-05-25
The unsaturated polyester resin molding composition of the invention comprising an unsaturated polyester, a vinyl monomer, a stabilizer, a thermoplastic resin, an organic peroxide, a fluidity modifier, a thickening agent, a filler and a fibrous reinforcement material possesses curability at low temperatures of about 50 to 120°C, good fluidity and filling property on the occasion of molding at low pressures of about 0.1 to 20 kgf/cm², and good storage stability at room temperature.
本发明的不饱和聚酯树脂模塑组合物由不饱和聚酯、乙烯基单体、稳定剂、热塑性树脂、有机过氧化物、流动性改良剂、增稠剂、填料和纤维增强材料组成,在约 50 至 120°C 的低温下具有固化性,在约 0.1 至 20 kgf/cm² 的低压下模塑时具有良好的流动性和填充性,在室温下具有良好的储存稳定性。