POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATTERN FORMING METHOD USING SAME
申请人:Maeda Katsumi
公开号:US20120021357A1
公开(公告)日:2012-01-26
A photosensitive insulating resin composition, comprising a polymer, a photosensitizer, and an amide derivative that is expressed by the following general formula (1);
(in formula (1), R
1
represents a bivalent alkyl group, R
2
represents a hydrocarbon group with a carbon number of 1 to 10, and R
3
represents a hydrogen atom or an alkyl group with a carbon number of 1 to 4.)
The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R
1
represents a hydrogen atom or a methyl group; R
2
represents an acid-decomposable group; and R
3
to R
6
independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.