Csp<sup>3</sup>–Csp<sup>3</sup> Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes
作者:Matthew Paeth、Sam B. Tyndall、Liang-Yu Chen、Jia-Cheng Hong、William P. Carson、Xingwu Liu、Xiaodong Sun、Jinjia Liu、Kundi Yang、Elizabeth M. Hale、David L. Tierney、Bin Liu、Zhi Cao、Mu-Jeng Cheng、William A. Goddard、Wei Liu
DOI:10.1021/jacs.8b12632
日期:2019.2.20
Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp3-Csp3 bonds. We report herein a general method for the synthesis
从难以捉摸的有机铜 (III) 配合物中形成碳-碳键的还原消除被认为是许多铜催化和有机铜酸盐反应的关键步骤。然而,具有明确结构且可以进行还原消除的有机铜 (III) 配合物极为罕见,尤其是对于 Csp3-Csp3 键的形成。我们在此报告了合成一系列 [烷基-CuIII-(CF3)3]-配合物的通用方法,其结构已通过 NMR 光谱、质谱和 X 射线晶体衍射明确表征。在升高的温度下,这些配合物按照一级动力学进行还原消除,以良好的产率(高达 91%)形成烷基-CF3 产物。