3-((naphthalene-1-yloxy)carbonyl)benzoic acid | 1451150-93-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3-((naphthalene-1-yloxy)carbonyl)benzoic acid
• 英文别名: 3-Naphthalen-1-yloxycarbonylbenzoic acid；3-naphthalen-1-yloxycarbonylbenzoic acid
• CAS: 1451150-93-8
• 化学式: C₁₈H₁₂O₄
• 分子量: 292.291
• InChiKey: OYXLKHVOIHISEL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4
• 重原子数：
  22
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  63.6
• 氢给体数：
  1
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  iso-phthalic acid monobenzyl ester 在 palladium on activated charcoal 、 氢气 、 盐酸-N-乙基-Nˊ-(3-二甲氨基丙基)碳二亚胺 作用下， 以 四氢呋喃 、 甲醇 为溶剂， 20.0 ℃ 、400.01 kPa 条件下， 反应 17.5h， 生成 3-((naphthalene-1-yloxy)carbonyl)benzoic acid
  参考文献：
  名称：

  Development of 3,5-dinitrobenzoate-based 5-lipoxygenase inhibitors

  摘要：

  Human 5-lipoxygenase (5-LOX) is a well-validated target for anti-inflammatory therapy. Development of novel 5-LOX inhibitors with higher activities is highly demanded. In previous study, we have built a model for the active conformation of human 5-LOX, and identified naphthalen-1-yl 3,5-dinitrobenzoate (JMC-4) as a 5-LOX inhibitor by virtual screening. In the present work, 3,5-dinitrobenzoate-based 5-lipoxygenase inhibitors were developed. Twenty aryl 3,5-dinitrobenzoates, N-aryl 3,5-dinitrobenzamides and analogues were designed and synthesized. Several of them were found with significantly increased activities according to cell-free assay and human whole blood assay. The structure-activity relationship study may provide useful insights for designing effective 5-LOX inhibitors. (C) 2014 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.bmc.2014.03.008

文献信息

• Resin composition, sheet-shaped laminated material, printed wiring board, and semiconductor device
  申请人：AJINOMOTO CO., INC.

  公开号：US10711088B2

  公开（公告）日：2020-07-14

  Provided is a resin composition that can provide a cured product of low dielectric tangent, high mechanical strength, and high adhesiveness. The resin composition contains (A) a resin having a thermosetting functional group FA, (B) a resin having a radical polymerizable functional group FB, and (C) a resin having a functional group FA′ reacting with the thermosetting functional group FA and a functional group FB′ reacting with the radical polymerizable functional group FB. A number na of the functional group FA′ of the component (C) when the number of the thermosetting functional group FA of the component (A) is defined as 1 and a number nb of the functional group FB′ of the component (C) when the number of the radical polymerizable functional group FB of the component (B) is defined as 1 satisfy 0.01≤na≤200 and 0.01≤nb≤400, respectively.

  本发明提供了一种树脂组合物，它能提供低介电常数、高机械强度和高粘合性的固化产品。该树脂组合物包含（A）具有热固性官能团 FA 的树脂，（B）具有可自由基聚合的官能团 FB 的树脂，以及（C）具有与热固性官能团 FA 反应的官能团 FA′和与可自由基聚合的官能团 FB 反应的官能团 FB′的树脂。当组分(A)的热固性官能团 FA 的数目定义为 1 时，组分(C)的官能团 FA′ 的数目 na；当组分(B)的可自由基聚合的官能团 FB 的数目定义为 1 时，组分(C)的官能团 FB′ 的数目 nb 分别满足 0.01≤na≤200 和 0.01≤nb≤400。
• RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD
  申请人：Morita Masaki

  公开号：US20130199830A1

  公开（公告）日：2013-08-08

  By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
• RESIN COMPOSITION, SHEET-SHAPED LAMINATED MATERIAL, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
  申请人：AJINOMOTO CO., INC.

  公开号：US20190276585A1

  公开（公告）日：2019-09-12

  Provided is a resin composition that can provide a cured product of low dielectric tangent, high mechanical strength, and high adhesiveness. The resin composition contains (A) a resin having a thermosetting functional group FA, (B) a resin having a radical polymerizable functional group FB, and (C) a resin having a functional group FA′ reacting with the thermosetting functional group FA and a functional group FB′ reacting with the radical polymerizable functional group FB. A number n a of the functional group FA′ of the component (C) when the number of the thermosetting functional group FA of the component (A) is defined as 1 and a number n b of the functional group FB′ of the component (C) when the number of the radical polymerizable functional group FB of the component (B) is defined as 1 satisfy 0.01≤n a ≤200 and 0.01≤n b ≤400, respectively.
• ACTIVE ESTER COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL
  申请人：DIC Corporation

  公开号：US20210139641A1

  公开（公告）日：2021-05-13

  There are provided an active ester composition that has high curability and that provides a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance; a cured product of the composition; and a semiconductor sealing material and a printed wiring board that are formed from the composition. Specifically, an active ester composition containing an active ester compound and a benzoxazine compound as essential components is provided. Because the active ester composition containing the active ester compound and the benzoxazine compound as essential components is characterized by having high curability with a curing agent and providing a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance, the active ester composition is suitable for use as a resin material for semiconductor sealing materials and printed wiring boards.