2-Prop-2-ynylundecan-1-ol

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 2-Prop-2-ynylundecan-1-ol
• 英文别名: 2-prop-2-ynylundecan-1-ol
• 化学式: C₁₄H₂₆O
• 分子量: 210.36
• InChiKey: HMPJANMIAQVZJN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  15
• 可旋转键数：
  10
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF
  申请人：Shikoku Chemicals Corporation

  公开号：EP3075735A1

  公开（公告）日：2016-10-05

  The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.

  本发明提供了一种由通式 (Z) 代表的羟基苯磺酸： 其中基团 Z 代表羧烷基、缩水甘油基或烯丙基；R1 和 R2 各自独立地代表氢原子、低级烷基或苯基；R3、R4 和 R5 各自独立地代表氢原子或与基团 Z 相同的基团；但是，当基团 Z 是羧烷基时，R3、R4 和 R5 是与基团 Z 相同的羧烷基；当基团 Z 是烯丙基时，R5 代表氢原子。本发明进一步提供了各种树脂组合物，例如，聚酯树脂组合物、环氧树脂组合物和硅树脂组合物，每种组合物都包含羟基乙酸乙酯。
• INSULATING HEAT DISSIPATION SHEET
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3156457A1

  公开（公告）日：2017-04-19

  Provided is an insulating heat dissipation sheet hardly producing cracks, and exhibiting a favorable insulation property. The insulating heat dissipation sheet consists of a cured product of an organopolysiloxane composition comprising: (a) 100 parts by mass of an organopolysiloxane exhibiting an average degree of polymerization of 3,000 to 10,000; (b) 10 to 100 parts by mass of an organopolysiloxane exhibiting an average degree of polymerization of 2 to 2,000, and having alkenyl groups only at both ends of a molecular chain thereof, but at no other position on the molecular chain; (c) 2 to 20 parts by mass of an organohydrogenpolysiloxane having hydrogen atoms directly bonded to silicon atoms (Si-H groups); (d) 100 to 300 parts by mass of a boron nitride aggregate; (e) 0.1 to 10 parts by mass of a peroxide cross-linking agent; and (f) 0.1 to 10 parts by mass of a platinum group curing catalyst.

  本发明提供了一种不易产生裂缝并具有良好隔热性能的隔热散热片。这种隔热散热片由有机聚硅氧烷组合物的固化产物组成，该组合物包括 (a) 100 重量份的有机聚硅氧烷，其平均聚合度为 3,000 至 10,000； (b) 10 至 100 质量份的有机聚硅氧烷，其平均聚合度为 2 至 2,000，且仅在其分子链的两端有烯基，而在分子链的其他位置没有烯基； (c) 2 至 20 质量份的有机氢聚硅氧烷，其氢原子直接与硅原子结合（Si-H 基团）； (d) 100 至 300 质量份的氮化硼聚合体； (e) 0.1 至 10 质量份的过氧化物交联剂；以及 (f) 0.1 至 10 重量份的铂族固化催化剂。
• SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3287275A1

  公开（公告）日：2018-02-28

  The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m2•day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.

  本发明提供了一种硅树脂透明基材，包括一种或一种以上含有硅树脂组合物和纤维基的预浸料，其中硅树脂透明基材具有：硅树脂组合物与纤维基的附着量为60%(质量)或以上且99%(质量)或以下；根据JIS K 7375:2008中公开的方法测量，在450纳米处的总透光率为80%或以上，厚度为0.根据 JIS K 7129:2008 中公开的方法测量，厚度为 0.1 毫米至 0.4 毫米的硅树脂透明基材在 450 纳米波长下的总透光率为 80% 或以上；以及根据 JIS K 7129:2008 中公开的方法测量，厚度为 0.1 毫米至 0.4 毫米的硅树脂透明基材在 0.1 毫米至 0.4 毫米波长下的水蒸气透过率为 65 克/平方米-天或以下；以及制造方法。硅树脂透明基材具有优异的耐热性和耐候性，同时还具有柔韧性、高透明度和较低的透湿性。
• SILICON RESIN SUBSTRATE, METAL LAYER-FORMED SILICONE RESIN SUBSTRATE, CURED SILICONE RESIN SUBSTRATE, AND METAL LAYER-FORMED CURED-SILICONE RESIN SUBSTRATE
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3290201A1

  公开（公告）日：2018-03-07

  The present invention provides a silicone resin substrate, including quartz cloth and a silicone resin composition, wherein the silicone resin composition contains a silicon atom-bonded aryl group in an amount of 10% by moll or more and 99% by mol or less based on the whole silicon atom-bonded organic groups contained in the silicone resin composition. The present invention also provides a metal layer-formed silicone resin substrate, a cured silicone resin substrate, and a metal layer-formed cured-silicone resin substrate, using the silicone resin substrate. Each substrate excels in heat resistance and weather resistance as well as dielectric properties at high frequency.

  本发明提供了一种硅树脂基材，包括石英布和硅树脂组合物，其中硅树脂组合物含有硅原子键合芳基，其含量为硅树脂组合物所含全部硅原子键合有机基团的10%（摩尔）或以上，99%（摩尔）或以下。本发明还提供了一种使用硅树脂基底的金属层成型硅树脂基底、固化硅树脂基底和金属层成型固化硅树脂基底。每种基材都具有优异的耐热性、耐候性和高频介电性能。
• SILICONE COMPOSITION
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3741810A1

  公开（公告）日：2020-11-25

  Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm2/s at 25°C, (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40°C per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·°C) per 100 total parts by mass of components (A) and (B).

  本发明提供了一种具有高导热性和良好粘附性的有机硅组合物。一种有机硅组合物含有 (A) 50-99.9 质量份的有机聚硅氧烷，其每个分子至少有两个脂肪族不饱和烃基，在 25°C 时的运动粘度为 60-100,000 mm2/s；(B) 0.1-50质量份的硅树脂，其每个分子中至少有一个脂肪族不饱和烃基（条件是组分(A)和(B)的总质量为100质量份），(C)有机氢聚硅氧烷，(D)0.以组分(A)和(B)的总质量份数计，每 100 份组分(A)和(B)中含有 0.01-10.0 份有机过氧化物，其 10 小时半衰期温度至少为 40°C；以及(E) 以组分(A)和(B)的总质量份数计，每 100 份组分(A)和(B)中含有 100-3000 份导热填料，其导热系数至少为 10 W/(m-°C)。