2-[2-(2-Hydroxyethoxy)propoxy]ethyl 2-methylbutanoate

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 2-[2-(2-Hydroxyethoxy)propoxy]ethyl 2-methylbutanoate
• 英文别名: 2-[2-(2-hydroxyethoxy)propoxy]ethyl 2-methylbutanoate
• 化学式: C₁₂H₂₄O₅
• 分子量: 248.32
• InChiKey: RGWMHCVTAPQGAO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  17
• 可旋转键数：
  11
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.92
• 拓扑面积：
  65
• 氢给体数：
  1
• 氢受体数：
  5

文献信息

• PHOTOSENSITIVE COMPOSITION, PLANOGRAPHIC PRINTING PLATE PRECURSOR, POLYURETHANE, AND METHOD FOR PRODUCING POLYURETHANE
  申请人：FUJIFILM CORPORATION

  公开号：US20140134540A1

  公开（公告）日：2014-05-15

  A photosensitive composition includes (A) a polyurethane obtained by reacting a diol component including a compound represented by the following Formula (I) with a polyisocyanate component; and (B) a photosensitive component. In Formula (I), A represents a single bond, or a divalent linking group including an atom selected from the group consisting of a carbon atom, a hydrogen atom, and an oxygen atoms; B represents a monovalent organic group; each of R 1 to R 5 independently represents a hydrogen atom or an alkyl group; m represents an integer from 0 to 3; n represents an integer from 0 to 3; and m+n is not zero.

  一种光敏组合物，包括(A)聚氨酯和(B)光敏组分。聚氨酯是通过将包括以下式(I)的化合物的二元醇组分与多异氰酸酯组分反应而获得的。在式(I)中，A表示单键，或者包括从群组中选择的原子的双价连接基团，该群组包括碳原子，氢原子和氧原子；B表示单价有机基团；R1到R5中的每一个独立地表示氢原子或烷基；m表示从0到3的整数；n表示从0到3的整数；且m+n不为零。
• NEAR INFRARED RAY ABSORBENT COMPOSITION, NEAR INFRARED RAY CUT FILTER, SOLID IMAGE PICKUP ELEMENT, AND CAMERA MODULE
  申请人：FUJIFILM Corporation

  公开号：US20170227690A1

  公开（公告）日：2017-08-10

  Provided are a near infrared ray absorbent composition which can form a cured film having excellent near infrared ray shielding properties, a near infrared ray cut filter, a manufacturing method of a near infrared ray cut filter, a solid image pickup element, and a camera module. The near infrared ray absorbent composition includes a copper complex that is other than a copper phthalocyanine complex and has a maximum absorption wavelength in a wavelength range of 700 to 1,200 nm and in which a molar light absorption coefficient at the maximum absorption wavelength is greater than or equal to 100 (L/mol·cm).
• PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180118887A1

  公开（公告）日：2018-05-03

  Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
• RESIN FILM, COLORING PHOTOSENSITIVE COMPOSITION, RESIN FILM PRODUCTION METHOD, COLOR FILTER, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180196178A1

  公开（公告）日：2018-07-12

  Provided are a resin film which exhibits an excellent low reflectivity, a coloring photosensitive composition capable of forming a resin film which exhibits an excellent low reflectivity, a resin film production method, a color filter, a light shielding film, a solid-state imaging element, and an image display device. The resin film of the present invention includes at least two or more resins, a coloring agent, and a photoacid generator, in which the resin film has a peak at which the value of A1/A2 is greater than 0.1 and 2.5 or less in a light scattering measurement of the resin film, in the case where a half-width of the peak is A1 and a scattering angle of a maximum light intensity of the peak is A2 in a spectrum in which a scattering angle is plotted on the horizontal axis and a scattered light intensity is plotted on the vertical axis.
• RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180215874A1

  公开（公告）日：2018-08-02

  Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.