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[2-(Methoxymethoxy)-2-oxoethyl] 2,2-dimethylbutanoate

中文名称
——
中文别名
——
英文名称
[2-(Methoxymethoxy)-2-oxoethyl] 2,2-dimethylbutanoate
英文别名
[2-(methoxymethoxy)-2-oxoethyl] 2,2-dimethylbutanoate
[2-(Methoxymethoxy)-2-oxoethyl] 2,2-dimethylbutanoate化学式
CAS
——
化学式
C10H18O5
mdl
——
分子量
218.25
InChiKey
RXXPZAAWWDXELV-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.7
  • 重原子数:
    15
  • 可旋转键数:
    8
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.8
  • 拓扑面积:
    61.8
  • 氢给体数:
    0
  • 氢受体数:
    5

文献信息

  • ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD USING THE SAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    申请人:FUJIFILM CORPORATION
    公开号:US20150086912A1
    公开(公告)日:2015-03-26
    There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device.
  • PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK
    申请人:FUJIFILM Corporation
    公开号:US20170121437A1
    公开(公告)日:2017-05-04
    A pattern forming method includes forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, exposing the film with active light or radiation, and developing the exposed film using a developer including an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a compound having a partial structure represented by General Formula (I).
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