2-[8-[2-[8-[2-[3-Carboxy-5-[6-[8-[2-[8-[2-[3-[6-[8-[2-[8-[5-carboxy-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindol-2-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]-5-hydroxyphenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]phenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindole-5-carboxylic acid

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯
• 英文名称: 2-[8-[2-[8-[2-[3-Carboxy-5-[6-[8-[2-[8-[2-[3-[6-[8-[2-[8-[5-carboxy-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindol-2-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]-5-hydroxyphenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]phenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindole-5-carboxylic acid
• 英文别名: 2-[8-[2-[8-[2-[3-carboxy-5-[6-[8-[2-[8-[2-[3-[6-[8-[2-[8-[5-carboxy-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindol-2-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]-5-hydroxyphenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-2-yl]phenyl]-1,3,5,7-tetraoxopyrrolo[3,4-f]isoindol-6-yl]octyl]-4-hexyl-3-octylcyclohexyl]octyl]-1,3-dioxo-6-(2-prop-2-enoyloxyethoxycarbonyl)isoindole-5-carboxylic acid
• 化学式: C₁₉₁H₂₄₆N₁₀O₃₅
• 分子量: 3242.0
• InChiKey: TUSUXEAKOBAOHH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  50.8
• 重原子数：
  236
• 可旋转键数：
  111
• 环数：
  21.0
• sp3杂化的碳原子比例：
  0.59
• 拓扑面积：
  611
• 氢给体数：
  4
• 氢受体数：
  35

文献信息

• [EN] LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST<br/>[FR] PHOTORÉSINE DÉVELOPPABLE AQUEUSE, À FAIBLE MODULE, À TON NÉGATIF
  申请人：DESIGNER MOLECULES INC

  公开号：WO2014081894A1

  公开（公告）日：2014-05-30

  Hydrophobic, low modulus, photoimagable, functionalized polyimides have been discovered that can be developed using aqueous solutions. In particular, compositions containing the functionalized polyimides of the current invention can be used in the photolithography step for the passivation layer on a silicon wafer to reduce stress in thin wafers, or as a low modulus hydrophobic solder mask. These materials can serve as protective layers in other applications in which a thin, flexible, and hydrophobic polymer is required.