2-[[4-[1-[4-(Oxiran-2-ylmethoxy)phenyl]-3-phenyl-2,3-dihydroinden-1-yl]phenoxy]methyl]oxirane

• 分子结构分类: 有机化合物 - 苯类化合物 - 茚满类
• 英文名称: 2-[[4-[1-[4-(Oxiran-2-ylmethoxy)phenyl]-3-phenyl-2,3-dihydroinden-1-yl]phenoxy]methyl]oxirane
• 英文别名: 2-[[4-[1-[4-(oxiran-2-ylmethoxy)phenyl]-3-phenyl-2,3-dihydroinden-1-yl]phenoxy]methyl]oxirane
• 化学式: C₃₃H₃₀O₄
• 分子量: 490.6
• InChiKey: MXEFFJBWYQYERY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  37
• 可旋转键数：
  9
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10802401B2

  公开（公告）日：2020-10-13

  To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

  提供一种可碱性显影的底片型感光树脂组合物，通过该组合物可以获得具有高分辨率和低锥形图案形状的固化胶片，并且该胶片具有优异的耐热性和遮光性。阴图型感光树脂组合物的特点是含有 (A1) 第一树脂、(A2) 第二树脂、(C) 光聚合引发剂和 (D) 着色剂，其中 (A1) 第一树脂是 (A1-1) 聚酰亚胺和/或 (A1-2) 聚苯并噁唑，(A2) 第二树脂是选自 (A2-1) 聚酰亚胺前体、(A2-2) 聚苯并噁唑、(A2-3) 聚苯并噁唑、(A2-4) 聚苯并噁唑、(A2-5) 聚苯并噁唑和(A2-6) 聚苯并噁唑的一种或多种、(A2-2)聚苯并恶唑前体、(A2-3)聚硅氧烷、(A2-4)卡多基树脂和(A2-5)丙烯酸树脂中的一种或多种，其中(A1)第一树脂在(A1)第一树脂和(A2)第二树脂总质量的 100%中的含量比在 25 至 90 质量%的范围内。
• NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20180259852A1

  公开（公告）日：2018-09-13

  To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.
• NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20190258164A1

  公开（公告）日：2019-08-22

  The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1). In this resin composition, the radical-polymerizable compound (B) contains a flexible chain-containing radical-polymerizable compound (B1), the flexible chain-containing radical-polymerizable compound (B1) contains a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain, the aliphatic chain has an average molecular weight of 40 to 500, and the content of the pigment (D1) is 5 to 70 mass % of the total solid content.
• NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, ORGANIC EL DISPLAY PROVIDED WITH CURED FILM, AND METHOD FOR PRODUCING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20200110337A1

  公开（公告）日：2020-04-09

  The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20210198416A1

  公开（公告）日：2021-07-01

  A photosensitive resin composition contains (A) an ethylenically unsaturated group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photopolymerization initiator.