2,3,3-triethyl-1H-indene-1,2-diamine

• 分子结构分类: 有机化合物 - 苯类化合物 - 茚满类
• 英文名称: 2,3,3-triethyl-1H-indene-1,2-diamine
• 化学式: C₁₅H₂₄N₂
• 分子量: 232.36
• InChiKey: XKDCRTZTYDZFFN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.6
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS
  申请人：TAMURA CORPORATION

  公开号：US20140162072A1

  公开（公告）日：2014-06-12

  A thermosetting resin composition contains a liquid epoxy resin, a solid epoxy resin having a softening point of 125° C. or lower, an aromatic diamine compound including benzoate group and a main chain including polymethylene group, a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller, and a phenoxy resin having Tg of 130° C. or higher. A total of amounts of the solvent soluble polyamide resin and the phenoxy resin is 15 weight parts or more and 150 weight parts or less, provided that 100 weight parts are assigned to a total of amounts of the liquid epoxy resin, the solid epoxy resin and the aromatic diamine compound.