An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.
本发明公开了一种具有固化组分和环氧组分的环氧
树脂组合物。固化组分包括约 8%至约 70%(按组合物重量计)的一级固化剂和约 0.001%至约 5%(按组合物重量计)的二级固化剂。本公开包括固体二次固化剂的使用,特别是溶解的二次固化剂,以及配制这种溶解固体以形成液体固化组分的方法。环氧组合物还包括约 30%至约 92%(按重量计)的环氧组分组合物。固化组分中活性固化基团的当量数是环氧组分中
环氧化物当量数的约 0.50 至 0.98 倍。还公开了由环氧
树脂组合物形成的环氧产品。