A patterning process, including: forming the first resist film from first resist material containing an acid generator and thermosetting compound having a hydroxy group and/or carboxy group protected by an acid-labile group; forming the second resist film on first resist film from a second resist material containing a metal compound (A) and a sensitizer; irradiating the first and second resist film with a high energy beam or an electron beam to perform pattern exposure to deprotect the hydroxy group and/or carboxy group in a pattern exposed portion of first resist film and to form a crosslinked portion of the component (A) with the deprotected hydroxy and/or carboxy group on the pattern exposed portion; and developing the second resist film with a developer to give a metal film pattern composed of the crosslinked portion. This provides a method for forming a thin film resist pattern with higher resolution and higher sensitivity.
一种图形化方法,包括以下步骤:
1. 形成第
一抗蚀膜:使用包含酸发生剂及具有被酸敏感基团保护的羟基和/或羧基的热固性化合物的第
一抗蚀材料。
2. 形成第二抗蚀膜:在第
一抗蚀膜上使用包含
金属化合物(A)和感光剂的第二抗蚀材料。
3. 曝光:利用高能束或电子束照射第一和第二抗蚀膜,进行图形曝光。在此过程中,暴露区域的第
一抗蚀膜中的羟基和/或羧基的保护基团被去除,同时
金属化合物(A)与脱保护的羟基和/或羧基在该暴露区域形成交联部分。
4. 显影:使用显影剂显影第二抗蚀膜,形成由交联部分构成的
金属膜图案。
此方法能够实现更高分辨率和更高灵敏度的薄膜抗蚀图形制备。