EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
申请人:KIM Min Gyum
公开号:US20140179835A1
公开(公告)日:2014-06-26
An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1,
wherein A
1
is nitrogen or phosphorus; R
1
, R
2
, R
3
and R
4
are each independently a substituted or unsubstituted C
1
to C
30
hydrocarbon group, or a substituted or unsubstituted C
1
to C
30
hydrocarbon group including a hetero atom; X
1
, X
2
, X
3
, X
4
, X
5
and X
6
are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y
1
, Y
2
and Y
3
are each independently a substituted or unsubstituted C
1
to C
30
hydrocarbon group, or a substituted or unsubstituted C
1
to C
30
hydrocarbon group including a hetero atom.