A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of:
photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of:
and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.
一种光敏
树脂组合物包含一种改性聚
酰亚胺聚合物,其
化学结构式为
光敏单体、双
酚 A 环氧
树脂、光
引发剂和
颜料。改性聚
酰亚胺聚合物是由具有以下
化学结构式的聚
酰亚胺聚合物反应制成的:
和
甲基丙烯酸缩水甘油酯。聚
酰亚胺聚合物的羧基与
甲基丙烯酸缩水甘油酯的环氧基发生反应。聚
酰亚胺聚合物是由具有 A 基团的二酐单体、具有 R 基团的二胺单体、具有 R1 基团的二胺单体和具有 R2 基团的二胺单体反应而成。具有 R 基的二胺单体是具有与羧基成键的 R 基的二胺化合物。具有 R1 基团的二胺单体是软长链二胺单体。R2 基团包括至少一个仲胺基团或叔胺基团。