申请人:ITEQ CORPORATION
公开号:US20160148719A1
公开(公告)日:2016-05-26
The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df