Copper;4-methyl-3-oxopentanoate

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 酮酸及其衍生物
• 英文名称: Copper;4-methyl-3-oxopentanoate
• 英文别名: copper;4-methyl-3-oxopentanoate
• 化学式: C12H18CuO6
• 分子量: 321.81
• InChiKey: QAUFNODNRNGJTK-UHFFFAOYSA-L

计算性质

• 辛醇/水分配系数(LogP)：
  -1.3
• 重原子数：
  19
• 可旋转键数：
  4
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  114
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• COMPOSITION FOR FORMING COPPER PATTERN AND METHOD FOR FORMING COPPER PATTERN
  申请人：NOF CORPORATION

  公开号：US20140305684A1

  公开（公告）日：2014-10-16

  A composition for copper patterning and a method of copper patterning using the composition are provided, which composition is excellently safe in copper patterning, sintering at lower temperatures, and capable of forming a highly conducive copper pattern of a desired shape even on a plastic substrate. The composition contains Component A: a copper β-ketocarboxylate compound of formula (1): (R1, R2: H or C1-C6 straight- or C3-C6 branched-hydrocarbon group, etc.); and based on 1 mol of this compound, Component B: an amine compound having a boiling point of not higher than 250° C. at 0.1 to 500 mol; and Component C-1: an organic acid having pKa of not more than 4 at 0.01 to 20 mol, and/or Component C-2: an organic copper compound composed of copper and an organic acid having pKa of not more than 4 at 0.01 to 100 mol. The composition is useful in the field of electronics.

  提供了一种用于铜图案制作的组合物和使用该组合物的铜图案制作方法，该组合物在铜图案制作中非常安全，在较低温度下烧结，并能够在塑料基板上形成所需形状的高导电性铜图案。该组合物包含组分A：式（1）的铜β-酮酸盐化合物：（R1，R2：H或C1-C6直链或C3-C6支链烃基等）；并且基于1摩尔该化合物，组分B：沸点不高于250℃的胺化合物，0.1至500摩尔；以及组分C-1：pKa不超过4的有机酸，0.01至20摩尔，和/或组分C-2：由铜和pKa不超过4的有机酸组成的有机铜化合物，0.01至100摩尔。该组合物在电子领域中非常有用。
• US9157004B2
  申请人：——

  公开号：US9157004B2

  公开（公告）日：2015-10-13