10-[3-(3,5-Ditert-butyl-4-hydroxyphenyl)propanoyloxy]decyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 10-[3-(3,5-Ditert-butyl-4-hydroxyphenyl)propanoyloxy]decyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate
• 英文别名: 10-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]decyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate
• 化学式: C₄₄H₇₀O₆
• 分子量: 695.0
• InChiKey: QMIITXXNUWOTFU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  13.4
• 重原子数：
  50
• 可旋转键数：
  23
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.68
• 拓扑面积：
  93.1
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• Cured film formed by curing photosensitive resin composition and method for manufacturing same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10545406B2

  公开（公告）日：2020-01-28

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

  本发明提供了一种对金属铜具有高延伸率、低应力和高附着力的固化薄膜。该固化膜是通过固化感光树脂组合物形成的，其中感光树脂包括聚羟酰胺，固化膜中聚羟酰胺的环闭率不超过 10%。
• Cured film and method for producing same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10908500B2

  公开（公告）日：2021-02-02

  Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

  本发明提供了一种具有高耐化学腐蚀性、高伸长率以及与金属铜的高粘合性的固化膜。通过固化含有聚苯并恶唑前体的光敏树脂组合物而形成的固化膜，其中聚苯并恶唑前体环化成聚苯并恶唑的速率不低于 10%，不高于 60%。
• Resin and photosensitive resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11174350B2

  公开（公告）日：2021-11-16

  A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

  本发明提供了一种树脂和一种光敏树脂组合物，通过该树脂和组合物可以获得具有高延伸性、低应力和高金属粘附性的固化薄膜。一种树脂（A）包括聚酰胺结构和至少任何一种亚胺前体结构和亚胺结构，其中树脂（A）的至少任何一种结构包括具有脂肪族基团的二胺残基。
• Resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11347146B2

  公开（公告）日：2022-05-31

  The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

  本发明是一种树脂组合物，包括(a)树脂、(b)抗氧化剂和(d)交联剂，其中树脂组合物的特征如下：树脂 (a) 由一种或多种树脂组成，这些树脂选自聚酰亚胺前体、聚酰胺、聚酰亚胺、聚苯并恶唑及其共聚物；以及 交联剂 (d) 包括一个分子中的酚羟基，还包括在酚羟基的两个正交位置上分子量大于或等于 40 的取代基。本发明提供了一种树脂组合物，通过该树脂组合物获得的图案固化膜可以获得精细的图案，在 250°C 或更低的低温下固化，同时表现出优异的面内图案均匀性，即使在经过实际使用加速试验的可靠性评估后，仍能保持高延伸性和与金属丝的高粘合性。
• CURED FILM AND METHOD FOR MANUFACTURING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20180203353A1

  公开（公告）日：2018-07-19

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.