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1-(2-hydroxyphenyl)-1-(4-hydroxyphenyl)ethane | 62153-80-4

中文名称
——
中文别名
——
英文名称
1-(2-hydroxyphenyl)-1-(4-hydroxyphenyl)ethane
英文别名
2-[1-(4-Hydroxyphenyl)ethyl]phenol
1-(2-hydroxyphenyl)-1-(4-hydroxyphenyl)ethane化学式
CAS
62153-80-4
化学式
C14H14O2
mdl
——
分子量
214.264
InChiKey
WHMHCOGFWPOXSC-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    102-103 °C
  • 沸点:
    370.8±22.0 °C(Predicted)
  • 密度:
    1.171±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    3.6
  • 重原子数:
    16
  • 可旋转键数:
    2
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.14
  • 拓扑面积:
    40.5
  • 氢给体数:
    2
  • 氢受体数:
    2

反应信息

  • 作为产物:
    描述:
    乙醛苯酚 以4%的产率得到
    参考文献:
    名称:
    KOZLIKOVSKIJ, YA. B.;CHERNYAEV, B. V., ZH. ORGAN. XIMII, 1985, 21, N 11, 2403-2407
    摘要:
    DOI:
点击查看最新优质反应信息

文献信息

  • Via fill compositions for direct attach of devices and methods for applying same
    申请人:International Business Machines Corporation
    公开号:EP0653904A2
    公开(公告)日:1995-05-17
    The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes (14) with an epoxy or cyanate fill composition (16). When cured and overplated, the fill composition (16) provides support for the solder joint (22) and provides a flat solderable surface (18) for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    本发明通过用环氧树脂或氰酸酯填充组合物(16)填充电镀通孔(14),可直接在通孔和通孔上形成焊点,而无需将焊料泼洒到通孔或通孔中。当固化和过镀时,填充成分 (16) 可为焊点 (22) 提供支撑,并为互连提供平整的可焊表面 (18)。在某些实施例中,固化的填充组合物还具有导电的优点。本发明还涉及几种用这种填充组合物填充通孔的新方法,以及位于通孔和过孔中的电阻器。
  • Electrophotographic photoreceptor
    申请人:MITSUBISHI CHEMICAL CORPORATION
    公开号:EP1286224A1
    公开(公告)日:2003-02-26
    An electrophotographic photoreceptor, comprising a photosensitive layer formed on an electroconductive substrate, wherein the photosensitive layer comprises a resin having repeating units of the following formula (1): where, in the formula (1), A represents a plurality of bivalent groups including at least two members selected from the group consisting of bivalent groups of the following formulae (2), (3) and (4): where, in the formulae (2), (3) and (4), each of R1 to R24 which are independent of one another, represents a hydrogen atom, a substituted or unsubstituted C1-10 alkyl group, a substituted or unsubstituted C1-10 alkoxyl group, a halogen atom, a halogenated alkyl group or a substituted or unsubstituted C6-20 aromatic group, and each of X1, X2 and X3 which may be the same or different, represents a single bond, a bivalent organic group of the formula (5), -O-, -S-, -CO-, -SO2- or -(CH2)s- (wherein S is an integer of from 2 to 5): where, in the formula (5), each of R25 to R29 which are independent of one another, represents a hydrogen atom, a substituted or unsubstituted C1-10 alkyl group, a substituted or unsubstituted C1-10 alkoxyl group, a halogen atom, a halogenated alkyl group or a substituted or unsubstituted C6-20 aromatic group, provided that R25 and R26, and R27 and R28, may be bonded to each other to form a cycle, t is an integer of from 0 to 5, R29 is a C1-10 alkyl group, a C1-10 alkoxyl group, a halogen atom, a halogenated alkyl group or a substituted or unsubstituted C6-20 aromatic group, and u is an integer of from 0 to 4.
    一种电子照相感光器,包括在导电基底上形成的感光层,其中感光层包括具有下式(1)重复单元的树脂: 其中,在式 (1) 中,A 代表多个二价基团,包括至少两个从下式 (2)、(3) 和 (4) 的二价基团组成的组中选出的成员: 其中,在式(2)、(3)和(4)中,彼此独立的 R1 至 R24 各自代表氢原子、取代或未取代的 C1-10 烷基、取代或未取代的 C1-10 烷氧基、卤素原子、卤代烷基或取代或未取代的 C6-20 芳基,且 X1、X2 和 X3 可相同或不同,各自代表单键、式(5)的二价有机基团、 -O-、-S-、-CO-、-SO2- 或-(CH2)s-(其中 S 为 2 至 5 的整数): 其中,在式 (5) 中,相互独立的 R25 至 R29 分别代表氢原子、取代或未取代的 C1-10 烷基、取代或未取代的 C1-10 烷氧基、卤素原子、卤代烷基或取代或未取代的 C6-20 芳基、t为 0 至 5 的整数,R29 为 C1-10 烷基、C1-10 烷氧基、卤素原子、卤代烷基或取代或未取代的 C6-20 芳基,u 为 0 至 4 的整数。
  • POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY, FILM, PLATE AND INJECTION-MOLDED ARTICLE OBTAINED BY MOLDING SAME
    申请人:Mitsubishi Chemical Corporation
    公开号:EP2511339A1
    公开(公告)日:2012-10-17
    An object of the present invention is to provide a polycarbonate resin composition excellent in weather resistance, transparency, hue, heat resistance, thermal stability, moldability, and mechanical strength, and a molded article obtained therefrom. The present invention relates to a polycarbonate resin composition (X) which includes a polycarbonate resin (A) and an aromatic polycarbonate resin (B), the polycarbonate resin (A) including a constitutional unit derived from a dihydroxy compound (a) having, as part of the structure thereof, a site represented by the following formula (1) and a constitutional unit derived from a dihydroxy compound (b) of an aliphatic hydrocarbon, wherein the proportion of the constitutional unit derived from the dihydroxy compound (b) of an aliphatic hydrocarbon based on all constitutional units each derived from a dihydroxy compound in the polycarbonate resin (A) is 45% by mole or more. (The case where the site represented by the formula (1) is part of -CH2-O-H is omitted.)
    本发明的目的是提供一种在耐候性、透明度、色调、耐热性、热稳定性、可模塑性和机械强度方面均具有优异性能的聚碳酸酯树脂组合物,以及由此获得的模塑制品。本发明涉及一种聚碳酸酯树脂组合物 (X),它包括聚碳酸酯树脂 (A) 和芳香族聚碳酸酯树脂 (B),聚碳酸酯树脂 (A) 包括一个由二羟基化合物 (a) 衍生的结构单元,作为其结构的一部分,该二羟基化合物 (a) 具有以下式(a)所代表的位点、由下式(1)表示的位点和由脂肪烃二羟基化合物(b)衍生的构型单元,其中由脂肪烃二羟基化合物(b)衍生的构型单元占聚碳酸酯树脂(A)中由二羟基化合物衍生的所有构型单元的比例为 45%(摩尔)或以上。 式(1)所代表的位点是-CH2-O-H 的一部分的情况省略)。
  • POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE
    申请人:Mitsubishi Chemical Corporation
    公开号:EP2511340A1
    公开(公告)日:2012-10-17
    The invention is to provide a polycarbonate resin composition having excellent weatherability, transparency, hue, heat resistance, thermal stability, moldability, and mechanical strength and a molded article obtained therefrom. The invention relates to: a polycarbonate resin composition which includes a polycarbonate resin (A) containing constituent units derived from a dihydroxy compound (a) having the portion represented by the following formula (1) as part of the structure thereof and an aromatic polycarbonate resin (B) having a reduced viscosity of 0.50 dL/g or higher; and a molded article obtained from the composition. (The case where the portion represented by the following formula (1) is part of -CH2-O-H is excluded.) [Chem. 1]         (̵CH2-O)̵     (1)
    本发明旨在提供一种聚碳酸酯树脂组合物,该组合物具有优异的耐候性、透明性、色调、耐热性、热稳定性、成型性和机械强度,以及由此获得的成型制品。本发明涉及:一种聚碳酸酯树脂组合物,其中包括一种聚碳酸酯树脂(A),该树脂含有从二羟基化合物(a)中提取的组成单元,该二羟基化合物具有下式(1)所代表的部分作为其结构的一部分,以及一种芳香族聚碳酸酯树脂(B),该芳香族聚碳酸酯树脂的降低粘度为 0.50 dL/g 或更高;以及一种由该组合物制成的模塑制品。(下式(1)所代表的部分为-CH2-O-H 的情况除外)。 [化学式 1] (̵CH2-O)̵ (1)
  • POLYCARBONATE RESIN COMPOSITION
    申请人:Mitsubishi Chemical Corporation
    公开号:EP2677003A1
    公开(公告)日:2013-12-25
    An object is to obtain a polycarbonate resin excellent in the heat resistance and impact resistance and endowed with high surface hardness. A polycarbonate resin composition (X), comprising: (A) a polycarbonate resin containing (a) a structural unit derived from a dihydroxy compound having a moiety represented by the following formula (1) in a part of a structure; and (B) an aromatic polycarbonate resin, wherein a reduced viscosity of the aromatic polycarbonate resin (B) is 0.55 dl/g or less, a proportion of the aromatic polycarbonate resin (B) in the polycarbonate resin composition (X) is 30 wt% or more, and a total light transmittance of the polycarbonate resin composition (X) is 90% or less:         [Chem. 1]    (̵CH2-O)̵     (1)
    目的是获得一种耐热性和抗冲击性优异且表面硬度高的聚碳酸酯树脂。 一种聚碳酸酯树脂组合物 (X),包括:(A) 聚碳酸酯树脂,其中含有(a) 结构单元,该结构单元衍生自具有下式 (1) 所代表分子的二羟基化合物;(B) 芳香族聚碳酸酯树脂,其中芳香族聚碳酸酯树脂 (B) 的降低粘度为 0.55 dl/g 或以下,芳香族聚碳酸酯树脂 (B) 在聚碳酸酯树脂组合物 (X) 中的比例为 30 wt% 或以上,聚碳酸酯树脂组合物 (X) 的总透光率为 90% 或以下: [化学式 1] (̵CH2-O)̵ (1)
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