TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20180024434A1
公开(公告)日:2018-01-25
The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1),
wherein X
1
represents a tetravalent organic group; and R
1
represents a group shown by the following general formula (2),
Y
1
n
Rf)
k
(2)
wherein the dotted line represents a bond; Y
1
represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition.