DIAMINE, POLYIMIDE, AND POLYIMIDE FILM AND UTILIZATION THEREOF
申请人:KANEKA CORPORATION
公开号:US20150011726A1
公开(公告)日:2015-01-08
Provided are (i) a polyimide which is transparent and has an excellent solution processability, a high heat resistance, and a low linear thermal expansion coefficient, and (ii) a polyimide film of the polyimide. According to the present invention, it is possible to produce, by use of a novel diamine characterized in having an amide group and a trifluoromethyl group, the polyimide which is transparent and has the excellent solution processability, the high heat resistance, and the low linear thermal expansion coefficient. The polyimide can be applied to various electronic devices such as an electronic display device.