MATERIAL FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20210198472A1
公开(公告)日:2021-07-01
The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent. In the formula (1), X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 2 to 10, R
1
represents at least one or more of the following formulae (2) to (4), where l1 represents 0 or 1, and l2 represents 0 or 1. Thus, provided is an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.