A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate.
The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PIA-1) or (A-2) a specific wholly aromatic polyamide (PAA-2) and the layer B comprises (B-1) a specific wholly aromatic polyimide (PIB-1), (B-2) a specific wholly aromatic polyamide (PAB-2), or (B-3) a specific resin composition (RCB-3) comprising a wholly aromatic polyimide (PIB-3) and a specific wholly aromatic polyamide (PAB-3), laminates comprising the same and a process for manufacturing the above laminate.
一种可用作电子封装应用中的绝缘层和半导体设备应用中用于固定半导体晶片的粘合膜的层压板、由其组成的层压板以及制造上述层压板的工艺。
层压板(I)包括基底层(A)和在层 A 的一侧或两侧形成的粘合层(B),层 A 是由(A-1)特定全芳香族聚
酰亚胺(
PIA-1)或(A-2)特定全芳香族聚酰胺(P
AA-2)制成的薄膜,层 B 包括(B-1)特定全芳香族聚
酰亚胺(
PIB-1)、(B-2) 特定全芳香族聚酰胺 (PAB-2),或 (B-3) 由全芳香族聚
酰亚胺 (
PIB-3) 和特定全芳香族聚酰胺 (PAB-3) 组成的特定
树脂组合物 (RCB-3)、包括上述组合物的层压板以及制造上述层压板的工艺。