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3-Ethylcarbamoyl-bicyclo[2.2.1]hept-5-ene-2-carboxylic acid | 126809-52-7

中文名称
——
中文别名
——
英文名称
3-Ethylcarbamoyl-bicyclo[2.2.1]hept-5-ene-2-carboxylic acid
英文别名
3-(Ethylcarbamoyl)bicyclo[2.2.1]hept-5-ene-2-carboxylic acid
3-Ethylcarbamoyl-bicyclo[2.2.1]hept-5-ene-2-carboxylic acid化学式
CAS
126809-52-7
化学式
C11H15NO3
mdl
——
分子量
209.245
InChiKey
NPMLSXSPOQWBEU-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    0.5
  • 重原子数:
    15
  • 可旋转键数:
    3
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.64
  • 拓扑面积:
    66.4
  • 氢给体数:
    2
  • 氢受体数:
    3

文献信息

  • RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYIMIDE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME
    申请人:Katayama Hiroyuki
    公开号:US20090121255A1
    公开(公告)日:2009-05-14
    The present invention relates to a resin for optical-semiconductor-element encapsulation containing a polyimide which is produced by imidizing a polyimide precursor obtained by subjecting 5-norbornene-2,3-dicarboxylic anhydride or maleic anhydride, an aliphatic tetracarboxylic dianhydride, and an aliphatic diamine compound to a condensation polymerization reaction. The resin of the invention has excellent heat resistance and excellent light-transmitting properties. In addition, the present invention also relates to an optical semiconductor device containing an optical semiconductor element encapsulated with the resin.
  • SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND
    申请人:Sugioka Takuo
    公开号:US20100317774A1
    公开(公告)日:2010-12-16
    The present invention provides a silane compound which can be preferably used in an electronics application and the like, as a resin composition which is excellent in heat resistance, pressure resistance, water resistance, low moisture absorption property, low dielectric property, mechanical and chemical stability, and heat conductivity and capable of forming cured articles which hardly reduce physical properties even under severe environments such as high temperature and high pressure and high humidity; its production method, and a resin composition containing the silane compound. The silane compound of the present invention provides a silane compound having a siloxane bond and an imido bond, wherein the silane compound comprises a structure unit formed by connecting at least one organic skeleton having an imido bond to a silicon atom forming a siloxane bond, wherein the silane compound is defined by the following average composition formula: XaYbZcSiOd in the formula, X may be same or different and denotes a group including an organic skeleton having an imido bond, represented by the following formula (1); Z may be same or different and denotes an organic group having no imido bond; Y may be same or different and denotes at least one selected from the group consisting of hydrogen atom, hydroxyl group, halogen atom, and OR group; R may be same or different and denotes at least one selected from the group consisting of alkyl, acyl, aryl, and unsaturated aliphatic residual groups and may have a substituent; a is a numeral of 3 or lower but not 0; b is 0 or a numeral less than 3; c is 0 or a numeral less than 3; d is a numeral less than 2 but not 0; and a+b+c+2d=4, in the formula, R 1 denotes at least one structure selected from the group consisting of aromatic, heterocyclic, and alicyclic rings; x and z may be same or different and independently denote an integer of 0 or higher and 5 or lower; and y is 0 or 1.
  • US4068063A
    申请人:——
    公开号:US4068063A
    公开(公告)日:1978-01-10
  • US4176220A
    申请人:——
    公开号:US4176220A
    公开(公告)日:1979-11-27
  • US7829967B2
    申请人:——
    公开号:US7829967B2
    公开(公告)日:2010-11-09
查看更多

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