3,3-diamino-4,4'-diphenoxybenzophenone | 155085-20-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3-diamino-4,4'-diphenoxybenzophenone
• 英文别名: 3,3'-Diamino-4,4'-diphenoxybenzophenone；bis(3-amino-4-phenoxyphenyl)methanone
• CAS: 155085-20-4
• 化学式: C₂₅H₂₀N₂O₃
• 分子量: 396.445
• InChiKey: SONDVQSYBUQGDH-UHFFFAOYSA-N

物化性质

• 沸点：
  587.2±50.0 °C(predicted)
• 密度：
  1.265±0.06 g/cm3(Temp: 20 °C; Press: 760 Torr)(predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5
• 重原子数：
  30
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  87.6
• 氢给体数：
  2
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  硫光气 、 3,3-diamino-4,4'-diphenoxybenzophenone 在 吡啶 作用下， 反应 24.0h， 以59%的产率得到bis(3-isothiocyanato-4-phenoxyphenyl)methanone
  参考文献：
  名称：

  Srivastava, Ravi P.; Singh, Sudhir K.; Abuzar, Syed, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1993, vol. 32, # 10, p. 1035 - 1044

  摘要：

  DOI：
• 作为产物：
  描述：

  4,4-二氯-3,3-二硝基苯甲酮 在 镍 氢氧化钾 、 氢气 作用下， 以 乙醇 、 N,N-二甲基甲酰胺 为溶剂， 反应 47.0h， 生成 3,3-diamino-4,4'-diphenoxybenzophenone
  参考文献：
  名称：

  Srivastava, Ravi P.; Singh, Sudhir K.; Abuzar, Syed, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1993, vol. 32, # 10, p. 1035 - 1044

  摘要：

  DOI：

文献信息

• COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20160046552A1

  公开（公告）日：2016-02-18

  A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W 1 and W 2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R 1 is a single bond or a C1-4 alkylene group, R 2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R 1 , R 2 , and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y 1 , Y 2 ) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R 3a and R 3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.

  这个组合物包含一种含有新颖乙烯基团的化合物。该组合物包含一个由通式（1）表示的含有乙烯基团的化合物。在该式中：W1和W2代表由通式（2）表示的一个基团（其中环（Z）是芳香烃环，X是一个单键或—S—，R1是一个单键或C1-4烷基基团，R2是特定的取代基团，如一价碳氢化合物，m是大于或等于0的整数），一个由通式（4）表示的基团（其中环（Z）、X、R1、R2和m如前述），一个羟基，或一个（甲基）丙烯酰氧基团；环（Y1、Y2）是芳香烃环；R代表一个单键或一个特定的二价基团；R3a和R3b代表氰基、卤素原子或一价碳氢基团；n1和n2是0-4的整数。
• ACETYLENE COMPOUND, SALT THEREOF, CONDENSATE THEREOF, AND COMPOSITION THEREOF
  申请人：Fujifilm Corporation

  公开号：EP2202220A1

  公开（公告）日：2010-06-30

  [Problem to be Solved] To provide an acetylene compound having a structure in which a unit having an amino group and a unit having an ethynyl group are bonded via a linking group, the acetylene compound being introducable to a polymer having thermal resistance. [Means for Solving the Problem] An acetylene compound represented by the following Formula (1) and a salt thereof: wherein in Formula (1), X represents a single bond or a divalent linking group; A represents a hydrocarbon group, a heteroaromatic ring or a heteroalicyclic compound; B represents a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a single bond; R1 represents a hydrogen atom, a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a silyl group; R4 represents a hydrogen atom or a group that can be a substituent of an amino group; and m, n and a each independently represent an integer of 1 or greater.

  解决的问题是提供一种乙炔化合物，其结构中含有通过连接基团连接的具有氨基团和乙炔基团的单元，该乙炔化合物可引入到具有热阻抗的聚合物中。解决问题的方法是通过以下式（1）表示的乙炔化合物及其盐：其中在式（1）中，X代表单键或二价连接基团；A代表烃基团、杂环芳香环或杂环脂环化合物；B代表烃基团、杂环芳香环、杂环脂环化合物或单键；R1代表氢原子、烃基团、杂环芳香环、杂环脂环化合物或硅基团；R4代表氢原子或可作为氨基团的取代基团；m、n和a分别独立表示大于或等于1的整数。
• BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Katayama Mami

  公开号：US20110086311A1

  公开（公告）日：2011-04-14

  A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.

  一种光敏树脂组合物，具有分辨率优良、成本低廉和可用于一系列聚合物前体结构的特点，其中每种聚合物前体都可以通过碱性物质或在碱性物质的存在下加热反应成为最终产物。该光敏树脂组合物包括一种具有特定结构并通过电磁辐射和加热产生碱性物质的基发生剂，以及一种聚合物前体，该聚合物前体通过基发生剂和碱性物质或在碱性物质的存在下加热反应成为最终产物。
• Polyimides and polyamic acids
  申请人：——

  公开号：US20020182536A1

  公开（公告）日：2002-12-05

  A polyimide having a repeating unit of the general formula (I) and a polyamic acid having a repeating unit of the formula (IV): 1 (wherein, R 1 and R 2 represent H or a C1 to C20 alkyl group, and Z represents a condensed polycyclic aromatic group or an group of the following formulae: 2 Herein, X represents —CO— or —C(═N 2 )—, Y represents a direct bond, —CH 2 —, —O—, —SO 2 —, —S—, —CO— or —C(═N 2 )—, and W represents a direct bond, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —S—, —SO—, —SO 2 — or —O—. b, m and n are 0 or 1; r is a C1 to 4 alkyl group, halogen group or phenyl group; a is 0 or 1 to 3.).

  具有通式(I)重复单元的聚酰亚胺和具有通式(IV)重复单元的聚酰胺酸：1（其中，R1和R2代表H或C1至C20烷基，Z代表缩聚的多环芳族基或以下式的基团：2，其中，X代表—CO—或—C(═N2)—，Y代表直接键，—CH2—，—O—，—SO2—，—S—，—CO—或—C(═N2)—，W代表直接键，—CH2—，—C(CH3)2—，—C(CF3)2—，—S—，—SO—，—SO2或—O—。b，m和n为0或1；r为C1至4烷基，卤素基或苯基；a为0或1至3。）
• Readily soluble, amorphous polyimide, and preparation process of same
  申请人：Mitsui Toatsu Chemicals, Inc.

  公开号：US05480965A1

  公开（公告）日：1996-01-02

  This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

  本发明涉及一种新型热塑性和非晶态聚酰亚胺，该聚酰亚胺在有机溶剂中易溶，一种用于聚酰亚胺的新型芳香族二氨基化合物，其制备方法，包括热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物，制备该树脂组合物的方法，树脂组合物的注射成型制品，通过模压上述可溶性和热塑性聚酰亚胺与纤维增强剂的组合得到的聚酰亚胺基复合材料，以及用上述聚酰亚胺改性的纤维增强剂。该聚酰亚胺包括必需的结构单元，其中包含一个或多个重复的结构单元，其化学式为：##STR1## 其中m和n分别是0或1的整数，R是##STR2## 本发明的聚酰亚胺基本上是非晶态的，在低温下具有比传统已知聚酰亚胺更好的熔流稳定性，并且具有极大的改善加工性能。本发明的聚酰亚胺是通过使用新型芳香族二氨基化合物作为单体获得的，可以通过侧链而不是主链控制熔流能力和溶解性等各种性质。因此，可以在保持由本发明的二氨基化合物的苯并酮结构导致的高耐热性和粘合性的同时，获得优异的熔流性和溶解性。